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BZT52-C16ST/R13

Description
Zener Diode, 16V V(Z), 5%, 0.2W, Silicon, Unidirectional, ROHS COMPLIANT, PLASTIC PACKAGE-2
CategoryDiscrete semiconductor    diode   
ManufacturerPANJIT
Websitehttp://www.panjit.com.tw/
Environmental Compliance  

PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values ​​include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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BZT52-C16ST/R13 Overview

Zener Diode, 16V V(Z), 5%, 0.2W, Silicon, Unidirectional, ROHS COMPLIANT, PLASTIC PACKAGE-2

BZT52-C16ST/R13 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerPANJIT
package instructionR-PDSO-F2
Contacts2
Reach Compliance Codecompliant
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance40 Ω
JESD-30 codeR-PDSO-F2
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityUNIDIRECTIONAL
Maximum power dissipation0.2 W
Nominal reference voltage16 V
surface mountYES
technologyZENER
Terminal formFLAT
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Maximum voltage tolerance5%
Working test current5 mA

BZT52-C16ST/R13 Preview

Download Datasheet
BZT52-C2V4S SERIES
SURFACE MOUNT SILICON ZENER DIODES
VOLTAGE
2.4 to 75 V
olts
POWER
200 mWatts
FEATURES
• Planar Die construction
• 200mW Power Dissipation
• Zener Voltages from 2.4~75V
• Ideally Suited for Automated Assembly Processes
• Lead free in comply with EU RoHS 2002/95/EC directives.
• Green molding compound as per IEC61249 Std. . (Halogen Free)
0.054(1.35)
0.045(1.15)
0.014(0.35)
0.009(0.25)
0.038(0.95)
0.027(0.70)
0.078(1.95)
0.068(1.75)
MECHANICAL DATA
• Case: SOD-323, Molded Plastic
• Terminals: Solderable per MIL-STD-750, Method 2026
• Polarity: See Diagram Below
• Approx. Weight: 0.00014 ounces, 0.0041 grams
• Mounting Position: Any
0.006(0.15)
0.002(0.05)
0.107(2.7)
0.090(2.3)
0.012(0.30)MIN.
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25 C unless otherwise noted)
PARAMETER
Power Dissipation (Notes A) at T
A
= 25
O
C
Operating Junction Temperature and StorageTemperature Range
SYMBOL
VALUE
200
-55 to +150
UNITS
mW
O
o
P
D
T
J
C
NOTES:
A. Mounted on 5.0mm
2
(.013mm thick) land areas.
1
Cathode
2
Anode
October 07,2011-REV.04
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