BZM5254 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Discrete semiconductor> diode> BZM5254

BZM5254: DescriptionZener Diode, 27V V(Z), 5%, 0.5W, Silicon, Unidirectional, ROHS COMPLIANT, GLASS, MICROMELF-2; CategoryDiscrete semiconductor diode; File Size104KB，5 Pages; ManufacturerPANJIT; Websitehttp://www.panjit.com.tw/; Environmental Compliance; PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

Download Datasheet Parametric View All

BZM5254 Overview

Zener Diode, 27V V(Z), 5%, 0.5W, Silicon, Unidirectional, ROHS COMPLIANT, GLASS, MICROMELF-2

BZM5254 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	PANJIT
Parts packaging code	MELF
package instruction	ROHS COMPLIANT, GLASS, MICROMELF-2
Contacts	2
Reach Compliance Code	compliant
ECCN code	EAR99
Shell connection	ISOLATED
Configuration	SINGLE
Diode component materials	SILICON
Diode type	ZENER DIODE
JESD-30 code	O-LELF-R2
Number of components	1
Number of terminals	2
Maximum operating temperature	175 °C
Package body material	GLASS
Package shape	ROUND
Package form	LONG FORM
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
polarity	UNIDIRECTIONAL
Maximum power dissipation	0.5 W
Nominal reference voltage	27 V
surface mount	YES
technology	ZENER
Terminal form	WRAP AROUND
Terminal location	END
Maximum time at peak reflow temperature	NOT SPECIFIED
Maximum voltage tolerance	5%

BZM5254 Preview

Download Datasheet

View All

BZM5221B SERIES

SURFACE MOUNT ZENER DIODES

VOLTAGE

2.4 to 75 Volts

POWER

500 mWatts

MICRO-MELF

Unit : inch (mm)

FEATURES

• Planar Die construction

• 500mW Power Dissipation

• Ideally Suited for Automated Assembly Processes

.040(1.0)

.048(1.2)DIA.

MECHANICAL DATA

• Case: Molded Glass MICRO-MELF

• Terminals: Solderable per MIL-STD-750, Method 2026

• Polarity: See Diagram Below

• Approx. Weight: 0.008 grams

• Mounting Position: Any

• Packing information

T/R - 2.5K per 7" plastic Reel

.079(2.0)

.071(1.8)

.043(1.1)

.008(0.2)

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Parameter

Power Dissipation at Tamb = 25

Junction Temperature

Storage Temperature Range

Valid provided that leads at a distance of 8mm from case are kept at ambient temperature.

Symbol

Value

500

175

-65 to +175

Units

TOT

Parameter

Thermal Resi stance Juncti on to Ambi ent Ai r

Forward Voltage at I

= 200mA

Symbol

J A

Min.

Typ.

Max.

0.3

Uni ts

K/mW

Vali d provi ded that leads at a di stance of 8mm from case are kept at ambi ent temperature.

STAD-DEC.22.2008

PAGE . 1

Recommended Resources

Thermal low flow rate flowmeter circuit diagram

Dual output desktop power supply circuit

Negative voltage tracking positive voltage stabilized power supply circuit diagram

High voltage fast photocoupler and application circuit

555 touch mode timer energy-saving lamp circuit

Samsung CE959 microwave oven circuit

Design of overvoltage protection circuit in TI chip Buck-Boost circuit: [i=s]This post was last edited by qwqwqw2088 on 2020-7-31 08:22[/i]TPS92692-Q1 is an LED driver chip for automotive lighting. It is widely used in automotive LED lights because it can be designed into...; qwqwqw2088 Analogue and Mixed Signal

Sharing the OS transplantation and application of Lingdongwei MM32 MCU--Based on I2C interface control of AMetal platform: [i=s]This post was last edited by Hot Ximixiu on 2021-6-15 08:52[/i]The MM32L0 series includes a hardware I2C interface that supports master and slave modes and can control all devices that comply wit...; 火辣西米秀 Domestic Chip Exchange

What do you think of the official open source of Huawei's Ark Compiler?: On the evening of August 29, @Huawei EMUI officially announced that the revolutionary Ark compiler will be officially open source on August 31.On April 11, Yu Chengdong officially released the Ark Com...; eric_wang Talking

[New version of Zhongke Bluexun AB32VG1 RISC-V development board] - 5: Enhanced version of Blink: [i=s]This post was last edited by MianQi on 2021-8-13 07:52[/i]A few updates to the "Blink" from the previous post: Previously, RGB Blink used the same thread. Now, a thread is created for each of the...; MianQi Domestic Chip Exchange

Current Status and Future Development of Satellite Mobile Communications: Abstract : Satellite mobile communication systems have the advantages of wide coverage and insensitivity to ground conditions, and have become an important part of ground mobile communication, especia...; btty038 RF/Wirelessly

Free Review - Topmicro Intelligent Display Module (5) Touch Screen: [i=s]This post was last edited by wenyangzeng on 2021-11-1 16:36[/i]Free Review - Topmicro Intelligent Display Module (5) Touch ScreenCreate a new project, add two pages PG0000 and PG0001, and configu...; wenyangzeng Test/Measurement

Popular Components