BAS54V datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Discrete semiconductor> BAS54V

Preview

BAS54V: DescriptionSchottky diodes; CategoryDiscrete semiconductor; File Size2MB，1 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

Download Datasheet View All

BAS54V Overview

Schottky diodes

Features

Product Name: Schottky Diode

Product model:BAS54V

product features:

Surface mount schottky barrier diode arrays

Product parameters:

Pd dissipated power: 150mW

Io rectified current: 200mA

VR reverse working voltage: 30V

VF forward buck: 1V

IR reverse current: 2uA

Trr forward recovery time: 5ns

Package: SOT-563

BAS54V Preview

Download Datasheet

View All

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

SOT-563 Plastic-Encapsulate Diodes

SOT-563

BAT54V

SCHOTTKY

BARRIER

DIODE

FEATURES

Surface mount schottky barrier diode arrays

Marking: KAV

Maximum Ratings @Ta=25℃

Parameter

Peak Repetitive Peak Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

Average Rectified Output Current

Power Dissipation

Thermal Resistance Junction to Ambient

Storage Temperature

Symbol

RRM

RWM

STG

Limit

200

150

833

-65-125

Unit

℃/W

℃

ELECTRICAL CHARACTERISTICS (Ta=25℃ unless otherwise specified)

Parameter

Reverse breakdown voltage

Reverse voltage leakage current

Symbol

(BR)

Test

= 100

=25V

=1mA

Forward voltage

=10mA

=30mA

=100mA

Total capacitance

Reverse recovery time

=1V,f=1MHz

=10mA, I

=10mA~1mA

=100Ω

conditions

Min

320

400

500

1000

Max

Unit

A,Jun,2011

Recommended Resources

TW-42 ultra-short wave radio transmitter high frequency power amplifier circuit part

Wiring diagram of speed-adjustable electric fan motor with shaking head function

MAX610 internal structure and pin arrangement

Utilize self-induced electromotive force to realize instantaneous protection circuit

TDA2004 power amplifier circuit

TI C6000 Hardware Architecture Optimization Strategy: [size=4]1. Choose the appropriate compilation options (introduction) [/size] [size=4]-o0/1/2/3: The most important optimization options; if -o3 is selected, the compiler will try all possible optimiza...; Aguilera Microcontroller MCU

Full of useful information! How to choose a rectifier bridge?: There are many types of bridge rectifiers: flat, round, square, bench (in-line and SMD), etc., with GPP and O/J structures. The rectifier current ranges from 0.5A to 100A, and the reverse peak voltage...; ohahaha Power technology

Design of RFID reader system using MF RC500 reader and AT89S51 microcontroller: 1 Introduction 　　RFID is the abbreviation of Radio Frequency Identification, also known as electronic tag, which is a technology that uses radio frequency signals to achieve contactless information tr...; Aguilera RF/Wirelessly

[New Year's Flavor Competition] Northeast New Year's Eve Dinner is Coming: This is the north, a small county town, a city that looks like a chessboard. In my memory, every year is so rich, and every year there are different dishes. Even if I leave my hometown, I always have ...; 飞扬2019 Talking

Drum motor starting noise: Dear all,when the wheel drum motor is idling, the controller starts the motor. Since the program needs to perform the charge pump action first, that is, the lower arm is short-circuited (10ms), this w...; mathimportant Motor Drive Control（Motor Control）

If China had not developed the Internet in the first place and instead invested in underlying development, it is estimated that China would be no less powerful than Europe and the United States now, right?: In our embedded WeChat group, a friend talked about the recent chip price increase that everyone is concerned about, saying that it is a monopoly of giants and they have the final say on the price. At...; eric_wang Talking

Popular Components