2SC3303Y(TO-251) datasheet, PDF

Datasheet> All Categories > Discrete semiconductor> The transistor> 2SC3303Y(TO-251)

2SC3303Y(TO-251): DescriptionTransistor; CategoryDiscrete semiconductor The transistor; File Size103KB，1 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

Download Datasheet Parametric View All

2SC3303Y(TO-251) Overview

Transistor

2SC3303Y(TO-251) Parametric

Parameter Name	Attribute value
package instruction	,
Reach Compliance Code	unknow
Base Number Matches	1

2SC3303Y(TO-251) Preview

Download Datasheet

View All

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

TO-251 Plastic-Encapsulate Transistors

2SC3303

TRANSISTOR (NPN)

TO – 251

1. BASE

2. COLLECTOR

3. EMITTER

FEATURES

Low Collector Saturation Voltage

High Speed Switching Time

MAXIMUM RATINGS (T

=25℃ unless otherwise noted)

Symbol

CBO

CEO

EBO

θJA

stg

Parameter

Collector-Base Voltage

Collector-Emitter Voltage

Emitter-Base Voltage

Collector Current

Collector Power Dissipation

Thermal Resistance From Junction To Ambient

Junction Temperature

Storage Temperature

Value

100

125

150

-55~+150

Unit

℃/W

℃

ELECTRICAL CHARACTERISTICS (T

=25℃ unless otherwise specified)

Parameter

Collector-base breakdown voltage

Collector-emitter breakdown voltage

Emitter-base breakdown voltage

Collector cut-off current

Emitter cut-off current

DC current gain

Collector-emitter saturation voltage

Base-emitter saturation voltage

Collector output capacitance

Transition frequency

Symbol

(BR)CBO

(BR)CEO

(BR)EBO

CBO

EBO

FE(1)

FE(2)

CE(sat)

BE(sat)

Test

conditions

Min

100

0.4

1.2

MHz

240

Typ

Max

Unit

μA

=100µA,I

=10mA,I

=100µA,I

=100V,I

=7V,I

=1V, I

=1A

=1V, I

=3A

=3A,I

=150mA

=3A,I

=150mA

=10V,I

=0, f=1MHz

=4V,I

=1A,

CLASSIFICATION OF h

FE(1)

RANK

RANGE

70-140

120-240

A,Dec,2010

Recommended Resources

Fluorescent lamp dimming circuit

Ultrasonic remote control light switch circuit

Hall sensor signal amplification circuit diagram

Electromechanical control automatic reciprocating motor control circuit

Two-digit BCD addition and subtraction arithmetic unit

Electric contact control circuit

The live broadcast has ended [Microchip Embedded Security Solutions | Anti-counterfeiting protection for disposable products]: Through this seminar, you will learn: ● How to use Microchip security devices and symmetric authentication to reduce the risk of counterfeiting disposable cartridges and consumables;● The architecture...; EEWORLD社区 Security Electronics

Comparison of the advantages of three-resistance current sampling and single-resistance: In terms of FOC, there are also three-resistor current sampling or single-resistor current sampling solutions on the market. So what are the advantages and disadvantages of these two solutions?First, ...; alan000345 RF/Wirelessly

[TI recommended course] #Innovation of general-purpose op amp and comparator chips#: //training.eeworld.com.cn/TI/show/course/5674...; glorys TI Technology Forum

An application example of a certain brand of high power density power module: ...; PowerAnts Power technology

Will the DS1100 delay chip affect my analog signal?: [i=s]This post was last edited by haha丶 on 2022-3-14 10:40[/i]I want to find a delay chip that can delay my analog signal by several ns or tens of ns. I found this DS1100 delay chip. I see that it has...; haha丶 ADI Reference Circuit

TPS61022 Constant Adjustable Heating Unit Power Supply Solution: A power supply solution for a heating unit, mainly including a lithium battery, a boost circuit (TPS61022) and a heating resistor (2 Ω). This solution supports a maximum output of 12.5W (5V/2.5A), and...; qwqwqw2088 Analogue and Mixed Signal

Popular Components