2SC2785 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Discrete semiconductor> 2SC2785

Preview

2SC2785: DescriptionNPN transistor; CategoryDiscrete semiconductor; File Size891KB，1 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

Download Datasheet View All

2SC2785 Overview

NPN transistor

Features

Product Name: NPN Transistor

Product model: 2SC2785

Product parameters:

Pcm (maximum dissipated power): 250mW

Ic (collector current): 100mA

BVcbo (Collector-Base Breakdown Voltage): 60V

BVceo (Collector-Emitter Breakdown Voltage): 50V

BVebo (emitter-base breakdown voltage): 5V

hFE (current gain): Min: 110, Max: 600

VCE (sat) saturation voltage drop: 0.3V

fT (transition frequency): 150MHz

Package: TO-92S

2SC2785 Preview

Download Datasheet

View All

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

TO-92S Plastic-Encapsulate Transistors

2SC2785

TRANSISTOR (NPN)

TO-92S

FEATURES

High voltage

Excellent h

Linearity

Complementary to 2SA1175 PNP transistor

1. EMITTER

2. COLLECTOR

3. BASE

MAXIMUM RATINGS (T

=25℃ unless otherwise noted)

Symbol

CBO

CEO

EBO

stg

Parameter

Collector-Base Voltage

Collector-Emitter Voltage

Emitter-Base Voltage

Collector Current -Continuous

Collector Power Dissipation

Junction Temperature

Storage Temperature

Value

0.1

0.25

150

-55-150

Unit

℃

ELECTRICAL CHARACTERISTICS (Tamb=25℃ unless otherwise specified)

Parameter

Collector-base breakdown voltage

Collector-emitter breakdown voltage

Emitter-base breakdown voltage

Collector cut-off current

Emitter cut-off current

DC current gain

Collector-emitter saturation voltage

Base-emitter saturation voltage

Base-emitter voltage

Transition frequency

Collector output capacitance

Noise figure

Symbol

(BR)CBO

(BR)CEO

(BR)EBO

CBO

EBO

FE(1)

FE(2)

CE(sat)

BE(sat)

Test

=100μA, I

=1mA, I

=100μA, I

=60V, I

=5V, I

=6V, I

=1mA

=6V, I

=0.1mA

=100mA, I

=10mA

=100mA, I

=10mA

=6V, I

=1mA

=6V, I

=10mA

=6V, I

=0,f=1MHz

=6V, I

=0.1mA,f=1KHZ, R

=2KΩ

150

110

0.3

0.65

MHz

conditions

MIN

0.1

600

TYP

MAX

UNIT

μA

CLASSIFICATION OF

Rank

Range

FE(1)

110-180

135-220

170-270

200-320

250-400

300-600

A,Jun,2011

Recommended Resources

Wattmeter circuit for measuring low frequency amplifier output power

TDA1553Q power amplifier circuit diagram

AC contactor low voltage starting

Electric moped charger

Video amplifier clock oscillator

Charging and discharging system composed of MAXl660

Which expert can give me a complete cadence project?: Help: Can any expert give me a complete cadence project, with a complete set of examples and geber files from vias, pads, component packages, schematics, and PCB wiring stages. I have learned cadence ...; bigbat PCB Design

Working principle, functional characteristics and classification of photoelectric liquid level sensors: [align=left][b]Working principle:[/b][/align][align=left]The photoelectric liquid level sensor contains a near-infrared light-emitting diode and a photosensitive receiver. The light emitted by the lig...; 天阶山木 Industrial Control Electronics

EEWORLD University Hall--Detailed explanation of MATLAB image functions and their applications: Detailed explanation of MATLAB image functions and their applications : https://training.eeworld.com.cn/course/4788MATLAB Image Processing Toolbox is one of the most popular image processing tools, an...; 老白菜 Embedded System

Get free high-speed digital design tips to avoid starting over with complex PCB designs: High-speed digital design and measurement are becoming increasingly complex.Do you always find distorted voltage waveforms only in the late stages of design? All yourprevious efforts go to waste, and ...; nmg Power technology

What is the value of open source? Preliminary findings from a European Commission study: pen-source presentsthe first results of a study conducted for the European Commission on the impact of open source software and open source hardware. The study finds that increasing investment in open...; dcexpert MicroPython Open Source section

[Erha Image Recognition Artificial Intelligence Vision Sensor] 1. Unboxing Experience: Thanks to eeworld and dfrobot for providing new product trials. This time, we received an easy-to-use artificial intelligence visual sensor (HuskyLens), which has 6 built-in functions: face recognitio...; dql2016 Domestic Chip Exchange

Popular Components