2SC2715 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Discrete semiconductor> 2SC2715

Preview

2SC2715: DescriptionNPN transistor; CategoryDiscrete semiconductor; File Size796KB，1 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

Download Datasheet View All

2SC2715 Overview

NPN transistor

Features

Product Name: NPN Transistor

Product model: 2SC2715

Product parameters:

Pcm (maximum power dissipation): 350mW

Ic (collector current): 50mA

BVcbo (collector-base breakdown voltage): 35V

BVceo (Collector-Emitter Breakdown Voltage): 30V

BVebo (emitter-base breakdown voltage): 4V

hFE (current gain): Min:40, Max:240

VCE (sat) saturation voltage drop: 0.4V

fT (transition frequency): 100MHz

Package: SOT-23

2SC2715 Preview

Download Datasheet

View All

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

SOT-23 Plastic-Encapsulate Transistors

SOT-23

2SC2715

FEATURES

TRANSISTOR (NPN)

BASE

EMITTER

COLLECTOR

High Power Gain

Recommended for FM IF,OSC Stage and AM CONV. IF Stage.

MAXIMUM RATINGS (T

=25℃ unless otherwise noted)

Symbol

CBO

CEO

EBO

stg

Parameter

Collector-Base Voltage

Collector-Emitter Voltage

Emitter-Base Voltage

Collector Current -Continuous

Collector Power Dissipation

Junction Temperature

Storage Temperature

Value

350

150

-55-150

Unit

℃

ELECTRICAL CHARACTERISTICS (T

=25℃ unless otherwise specified)

Parameter

Collector-base breakdown voltage

Collector-emitter breakdown voltage

Emitter-base breakdown voltage

Collector cut-off current

Emitter cut-off current

DC current gain

Collector-emitter saturation voltage

Base-emitter saturation voltage

Transition frequency

Power Gain

Symbol

(BR)CBO

(BR)CEO

(BR)EBO

CBO

EBO

FE(1)

CE(sat)

BE(sat)

Test conditions

μA,

mA, I

μA,

=35V, I

V, I

=12V, I

=2mA

mA, I

=10V, I

V, I

mA, f=

10.7M

100

Min

Typ

Max

Unit

0.1

240

0.4

400

μA

MHz

Gpe

CLASSIFICATION OF h

FE(1)

Rank

Range

Marking

40-80

RR1

70-140

RO1

120-240

RY1

A,May,2011

Recommended Resources

Instantaneous water heater automatic constant temperature experimental circuit diagram

Universal RF detector

MC34011 voltage stabilizing circuit diagram

Phase sequence detection circuit

Power factor compensation circuit

CNC triangle wave-square wave generator circuit diagram

The application channels for multiple development boards have been reopened. Come and apply if you are interested!: I often meet netizens who come to chat with me and say that they saw a forum organizing a certain development board review, but when they look at it, the application period for the event has passed? T...; okhxyyo Special Edition for Assessment Centres

Learn about RTOS in ten minutes!: A real-time operating system (RTOS) is software that manages the time of a microprocessor or microcontroller. A real-time system is one in which serious consequences may occur if the logic and timing ...; MamoYU Real-time operating system RTOS

Power communication - carrier communication: 1. Introduction to Carrier CommunicationPower line carrier communication (PLC) is a basic communication method unique to the power system. It refers to the technology of using existing power lines to ...; Jacktang Wireless Connectivity

PowerPC: 1. The Freescale series development board has a PowerPC processor. The NAND Uboot is burned into it through CodeWarrior 10.5.1, but the serial port does not print. The NAND Uboot can be successfully s...; gaolu ARM Technology

High salary recruitment of 5G filter design engineers located in Suzhou Industrial Park: Due to the company's strategic development needs, we are now recruiting 5G filter design engineers with high salary, starting from 400,000 yuan per year. Interested parties are welcome to contact us b...; zhoujingjing2 Recruitment

Bluetooth Low Energy Issues: I have a question for everyone.A recent product uses Bluetooth low energy. Because the Bluetooth module consumes more power, I want to cut off the power supply of the Bluetooth module when the power c...; chenbingjy stm32/stm8

Popular Components