2SA684S datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Discrete semiconductor> The transistor> 2SA684S

2SA684S: DescriptionTransistor; CategoryDiscrete semiconductor The transistor; File Size292KB，1 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

Download Datasheet Parametric View All

2SA684S Overview

Transistor

2SA684S Parametric

Parameter Name	Attribute value
package instruction	,
Reach Compliance Code	unknow
Maximum collector current (IC)	1 A
Configuration	Single
Minimum DC current gain (hFE)	170
Maximum operating temperature	150 °C
Polarity/channel type	PNP
Maximum power dissipation(Abs)	0.75 W
surface mount	NO
Base Number Matches	1

Recommended Resources

AN7117 power amplifier circuit diagram

Eddy current principle

Using HA1452 as a stereo preamplifier

Liquid level safety alarm circuit using thermistor

Principle block diagram of power intelligent monitoring system

Computer motherboard circuit diagram 810 2_19

80C51 Single Chip Microcomputer Temperature Measurement and Control System: How to use relay to control the conduction angle of voltage source in 80C51 single chip microcomputer temperature measurement and control system...; asthat 51mcu

GD32F305 CAN debugging failed: The cache cannot be released, and there is no waveform on the CAN chip. What is the reason?...; cheche1025 GD32 MCU

[Xianji HPM6750 Review] Simple unboxing and data download: At the end of last year, I saw news about HPM6750 on the Internet, and remembered two key pieces of information at the time - RISC-V core and a main frequency of up to 800MHz. Therefore, when I learne...; xusiwei1236 Domestic Chip Exchange

Why do electrolytic capacitors explode? How to avoid it?: [align=left][color=rgb(34, 34, 34)][font="]Electrolytic capacitors contain electrodes, dielectric materials, and electrolytes. Based on their structure and possible working conditions, the causes of e...; tiankai001 Analog electronics

Share a virtual oscilloscope HANTEK6022BE plug-in I wrote myself. If you have a HANTEK6022BE that is gathering dust, you can use it.: [i=s]This post was last edited by Haoyu HY on 2022-4-7 23:52[/i]This is a plug-in I wrote when I just bought HANTEK6022BE many years ago. To be honest, this oscilloscope is just like a toy. The bandwi...; 皓禹HY Test/Measurement

What should be paid attention to in the amplifier design of RF circuit PCB: In the microwave frequency band, how to ensure that the output signal of the amplifier will not be fed back to the input end? What should be paid attention to when connecting multi-stage amplifiers? I...; 明天你好123 PCB Design

Popular Components