Yangzhou Yangjie Electronic Technology Co., Ltd. was established on August 2, 2006 with a registered capital of RMB 472 million. In January 2014, the company was listed on the Shenzhen Stock Exchange's Growth Enterprise Market with the stock code 300373. In 2017, the company's operating income was RMB 1.47 billion. The company integrates R&D, production and sales, and is professionally committed to the industrial development of power semiconductor chips and device manufacturing, integrated circuit packaging and testing, etc. The company's main products are various power electronic device chips, power diodes, rectifier bridges, high-power modules, DFN/QFN products, SGT MOS and silicon carbide SBD, silicon carbide JBS, etc. The products are widely used in many fields such as consumer electronics, security, industrial control, automotive electronics, and new energy.
Now many embedded devices with network ports provide web-based configuration tools. I have recently been learning about the GO language, and some information says that the cross-platform characteristi...
The two pins of serial port 0 are P1.2 and P1.3代码：
#include ti/devices/msp432p4xx/driverlib/driverlib.h
uint8_t TXData = 1;
uint8_t RXData = 0;
/* UART Configuration Parameter. These are the configura...
The main function of a single-chip microcomputer is to control peripheral devices and realize certain communications and data processing. However, in certain specific occasions, mathematical operation...
Selecting the right wireless connectivity technology is a critical design decision from the outset. This determines the protocol interoperability, distance, robustness, and use cases of the applicatio...
Using HitechC Compiler in MPLAB-IDE1. Load the compiler:1. Start MPLAB-IDE and select Project-》Install Language Tool as shown below ( screen.width-300)this.width=screen.width-300" border=02. In the po...
Nowadays, with the evolution of cloud computing technology, IC design has begun to be combined with cloud computing technology. What is the industry's attitude towards this and what layouts have been...[Details]
In 2019, Intel finally mass-produced the 10nm process and launched the 10th-generation Core Ice Lake processor. The CPU and GPU architecture were fully upgraded, and the IPC performance increase...[Details]
On March 25, according to media reports, Nvidia will start purchasing large quantities of 12-layer HBM3E memory as early as September, and these memories will be exclusively supplied by Samsung Ele...[Details]
The Semiconductor Industry Association (SEMI) recently released the "2020 Semiconductor Industry Silicon Wafer Shipment Forecast Report". Data shows that global silicon wafer shipments will increase ...[Details]
On Thursday, the Wall Street Journal reported that AMD was planning to acquire Xilinx for $30 billion, which caused a stir in the industry. Bloomberg quoted the report as saying that AMD needed to ov...[Details]
The National Bureau of Statistics recently released the "Statistical Communiqué on the National Economic and Social Development of the People's Republic of China in 2020" (hereinafter referred to as ...[Details]
RF GaN-on-Si: The Best of Both Worlds
Ismail Nasr, Infineon Technologies, Neubiberg, Germany
As the world continues to strive for higher-speed connections with low lat...[Details]
Samsung Electronics' 4nm foundry process has reported that its yield rate has grown faster than industry expectations and continues to catch up with TSMC. After the Google smartphone Pixel 8 is launc...[Details]
Singapore's Lianhe Zaobao website recently reported that TSMC President Wei Zhejia predicted that the tight wafer foundry capacity problem will not only remain unresolved this year, but will continue...[Details]
According to a recent paper published in the journal Advanced Materials, researchers at Northeastern University have developed an all-ceramic material that can be die-cast into complex parts. This in...[Details]
Intel CEO Pat Gelsinger said during a Q&A session today that his company is willing to make chips for anyone, including longtime rival AMD. He reiterated Intel's goal to be the "foundry of the world"...[Details]
Currently, more than 70% of the world's chip production capacity is 12-inch (300mm) wafers, and the first 12-inch Fab line has been around for nearly 20 years. Why can't we see the next-generation 18...[Details]
On December 21, South Korean Deputy Prime Minister and Minister of Strategy and Finance Hong Nam-ki proposed ambitious development goals when presiding over the Innovation Growth Conference: the gove...[Details]
TSMC has recently decided to slow down its production expansion in Taiwan. However, new factories in the United States and Japan are proceeding according to established plans. TSMC, which is under pr...[Details]
Huawei's strong revenue capacity will inevitably drive the vigorous development of the industry chain, especially the local industry chain will benefit and share Huawei's growth. Companies including ...[Details]
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