Specification of Automotive MLCC
Supplier : Samsung electro-mechanics
Product : Multi-layer Ceramic Capacitor
A. Samsung Part Number
CL
①
①
Series
②
Size
③
Dielectric
④
Capacitance
⑤
Capacitance
tolerance
⑥
Rated Voltage
⑦
Thickness
10
②
B
③
473
④
K
⑤
B
⑥
8
⑦
5
⑧
P
⑨
N
⑩
C
⑪
Samsung P/N :
CL10B473KB85PNC
CAP, 47㎋, 50V, ±10%, X7R, 0603
Description :
AEC-Q 200 Specified
Samsung Multi-layer Ceramic Capacitor
0603 (inch code)
L: 1.6 ± 0.1 mm
X7R
47
㎋
±10 %
50 V
0.8 ± 0.1
⑧
Inner electrode
Termination
Plating
⑨
Product
⑩
Grade code
⑪
Packaging
W:
0.8 ± 0.1 mm
Ni , Open mode
Cu , Ag-epoxy
Sn 100%
(Pb Free)
Automotive
Standard
Cardboard Type, 7" reel
mm
B. Reliablility Test and Judgement condition
Performance
High Temperature
Exposure
Capacitance Change : Within ±10%
Tan
δ
: 0.03 max
IR : More than 10,000㏁ or 500㏁×㎌
Whichever is Smaller
Temperature Cycling
Appearance : No abnormal exterior appearance 1000Cycles
Capacitance Change : Within ±10%
Tan
δ
: 0.03 max
IR : More than 10,000㏁ or 500㏁×㎌
Whichever is Smaller
Destructive Physical
Analysis
Moisture Resistance
Appearance : No abnormal exterior appearance 10Cycles, t=24hrs/cycle
Capacitance Change : Within ±12.5%
Tan
δ
: 0.03 max
IR : More than 10,000㏁ or 500㏁×㎌
Whichever is Smaller
Humidity Bias
Appearance : No abnormal exterior appearance 1000hrs 85℃/85%RH, Rated Voltate and 1.3~1.5V,
Capacitance Change : Within ±12.5%
Tan
δ
: 0.035 max
IR : More than 500㏁ or 25㏁×㎌
Whichever is Smaller
High Temperature
Operating Life
Appearance : No abnormal exterior appearance 1000hrs @ TA=125℃, 200% Rated Voltage,
Capacitance Change : Within ±12.5%
Tan
δ
: 0.035 max
IR : More than 1000㏁ or 50㏁×㎌
Whichever is Smaller
Measurement at 24±2hrs after test conclusion
The charge/discharge current is less than 50mA.
Add 100kohm resistor
Measurement at 24±2hrs after test conclusion
The charge/discharge current is less than 50mA.
Heat (25~65℃) and humidity (80~98%), Unpowered
measurement at 24±2hrs after test conclusion
No Defects or abnormalities
Measurement at 24±2hrs after test conclusion
1 cycle condition :
-55+0/-3℃(15±3min) -> Room Temp(1min.)
-> 125+3/-0℃(15±3min) -> Room Temp(1min.)
Per EIA 469
Test condition
Measurement at 24±2hrs after test conclusion
Appearance : No abnormal exterior appearance Unpowered, 1000hrs@T=150℃
Performance
External Visual
No abnormal exterior appearance
Microscope (´10)
Using The calipers
Test condition
Physical Dimensions
Within the specified dimensions
Mechanical Shock
Appearance : No abnormal exterior appearance Three shocks in each direction should be applied along
Capacitance Change : Within ±10%
Tan
δ,
IR : initial spec.
3 mutually perpendicular axes of the test specimen (18 shocks)
Peakvalue
1,500G
Duration
0.5ms
Wave
Half sine
Velocity
4.7m/sec.
Vibration
Appearance : No abnormal exterior appearance 5g's for 20min., 12cycles each of 3 orientations,
Capacitance Change : Within ±10%
Tan
δ,
IR : initial spec.
Use 8"×5" PCB 0.031" Thick 7 secure points on one long side
and 2 secure points at corners of opposite sides. Parts mounted
within 2" from any secure point. Test from 10~2000㎐.
Resistance to
Solder Heat
Appearance : No abnormal exterior appearance Solder pot : 260±5℃, 10±1sec.
Capacitance Change : Within ±10%
Tan
δ,
IR : initial spec.
Thermal Shock
Appearance : No abnormal exterior appearance -55℃/+125℃.
Capacitance Change : Within ±10%
Tan
δ,
IR : initial spec.
Note: Number of cycles required-300,
Maximum transfer time-20 sec, Dwell time-15min. Air-Air
ESD
Appearance : No abnormal exterior appearance AEC-Q200-002
Capacitance Change : Within ±10%
Tan
δ,
IR : initial spec.
Solderability
95% of the terminations is to be soldered
evenly and continuously
a) Preheat at 155℃ for 4 hours, Immerse in solder for 5s at 245±5℃
b) Steam aging for 8 hours, Immerse in solder for 5s at 245±5℃
c) Steam aging for 8 hours, Immerse in solder for 120s at 260±5℃
solder : a solution ethanol and rosin
Electrical
Characterization
Capacitance : Within specified tolerance
Tan
δ
(DF) 0.025 max.
:
IR(25℃) : More than 10,000㏁ or 500㏁×㎌
IR(125℃) : More than1,000㏁ or 10㏁×㎌
Whichever is Smaller
Dielectric Strength
The Capacitance /D.F. should be measured at 25℃,
1㎑±10%, 1.0±0.2Vrms
I.R. should be measured with a DC voltage not exceeding
Rated Voltage @25℃, @125℃ for 60~120 sec.
Dielectric Strength : 250% of the rated voltage for 1~5 seconds
Board Flex
Appearance : No abnormal exterior appearance Bending to the limit (2㎜) for 5 seconds
Capacitance Change : Within ±10%
Terminal
Strength(SMD)
Beam Load
Appearance : No abnormal exterior appearance 10N, for 60±1 sec.
Capacitance Change : Within ±10%
Destruction value should not be exceed
Chip Length < 2.5㎜
a) Chip Thickness > 0.5㎜ : 20N
b) Chip Thickness
≤
0.5㎜ : 8N
X7R
(From -55℃ to 125℃, Capacitance change shoud be within ±15%)
Beam speed
0.5±0.05㎜/sec
Temperature
Characterisitcs
C. Recommended Soldering method :
Reflow ( Reflow Peak Temperature : 260+0/-5℃, 10sec. Max )
Meet IPC/JEDEC J-STD-020 D Standard
* For the more detail Specification, Please refer to the Samsung MLCC catalogue.
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
EEWORLD
