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TLE2161BMP

Part NumberTLE2161BMP
CategoryAnalog mixed-signal IC    Amplifier circuit   
File Size6832.26,33 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Download Datasheet Parametric

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TLE2161BMP Overview

Basic information of TLE2161BMP amplifier:

TLE2161BMP is an OPERATIONAL AMPLIFIER from Texas Instruments. Commonly used packaging methods are PLASTIC, DIP-8

TLE2161BMP amplifier core information:

The TLE2161BMP has a minimum operating temperature of -55 °C and a maximum operating temperature of 125 °C. Its peak reflow temperature is NOT SPECIFIED Its maximum average bias current is 0.04 µA

How to simply check the efficiency of an amplifier? Looking at its slew rate, the TLE2161BMP has a nominal slew rate of 10 V/us. The maximum slew rate of the TLE2161BMP given by the manufacturer is 0.375 mA, while the minimum slew rate is 5 V/us. Its minimum voltage gain is 7000. When the op amp is used in a closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the frequency when the TLE2161BMP gain becomes 0.707 times the low-frequency gain is 5600 kHz.

The nominal supply voltage of the TLE2161BMP is 15 V, and its corresponding nominal negative supply voltage is -15 V. The input offset voltage of TLE2161BMP is 1700 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)

Related dimensions of TLE2161BMP:

The width of TLE2161BMP is: 7.62 mm and the length is 9.81 mm. TLE2161BMP has 8 terminals. Its terminal position type is: DUAL. Terminal pitch is 2.54 mm. Total pins: 8

TLE2161BMP amplifier additional information:

TLE2161BMP adopts the VOLTAGE-FEEDBACK architecture. It belongs to the low-bias class of amplifiers. It does not belong to the low offset class of amplifiers. The frequency compensation status of TLE2161BMP is: YES (AVCL>=5). Its temperature grade is: MILITARY.

It is a micropower amplifier. TLE2161BMP is not Rohs certified. It contains lead. The corresponding JESD-30 code is: R-PDIP-T8. The packaging code of TLE2161BMP is: DIP.

The materials used for TLE2161BMP packaging are mostly PLASTIC/EPOXY. The package shape is RECTANGULAR. The TLE2161BMP package pin format is: IN-LINE. Its terminal form is: THROUGH-HOLE. The maximum seat height is 5.08 mm.

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