| Part Number | Manufacturer | Description |
|---|---|---|
| LMC6482AIMWA | Texas Instruments | DUAL OP-AMP, 750uV OFFSET-MAX, 1.5MHz BAND WIDTH, UUC, WAFER |
| LMC6462AIMWC | Texas Instruments | IC DUAL OP-AMP, 2000 uV OFFSET-MAX, 0.05 MHz BAND WIDTH, UUC, WAFER, Operational Amplifier |
Basic information of LMC6462BMWC amplifier:
LMC6462BMWC is an OPERATIONAL AMPLIFIER. Commonly used packaging methods are DIE, WAFER
LMC6462BMWC amplifier core information:
The minimum operating temperature of the LMC6462BMWC is -40 °C and the maximum operating temperature is 85 °C. Its peak reflow temperature is 260°C and its maximum average bias current is 0.000005 µA
How to simply check the efficiency of an amplifier? Looking at its slew rate, the LMC6462BMWC has a nominal slew rate of 0.023 V/us. The maximum slew rate of the LMC6462BMWC given by the manufacturer is 0.07 mA, while the minimum slew rate is 8 V/us. When the op amp is used in closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the LMC6462BMWC gain becomes 0.707 times the low-frequency gain at a frequency of 50 kHz.
The nominal supply voltage of LMC6462BMWC is 3 V, and its corresponding nominal negative supply voltage is. The input offset voltage of the LMC6462BMWC is 3000 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)
Related dimensions of LMC6462BMWC:
Its terminal position type is: UPPER.
LMC6462BMWC amplifier additional information:
LMC6462BMWC adopts the VOLTAGE-FEEDBACK architecture. It belongs to the low-bias class of amplifiers. It does not belong to the low offset class of amplifiers. The frequency compensation status of LMC6462BMWC is: YES. Its temperature grade is: INDUSTRIAL.
And its humidity sensitivity level is: 1. It is a micropower amplifier. The LMC6462BMWC is not Rohs certified. It does not contain lead. The corresponding JESD-30 code is: X-XUUC-N.
The packaging code of LMC6462BMWC is: DIE. The materials used in the LMC6462BMWC package are mostly UNSPECIFIED. The package shape is UNSPECIFIED. The LMC6462BMWC package pin format is: UNCASED CHIP. Its terminal forms are: NO LEAD.
LMC6462BMWC Also View
You may also be interested in
Popular Searches
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
About Us Customer Service Contact Information Datasheet Sitemap LatestNews
Site Related: China chips Training TI Training Datasheet EEWORLD
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
京公网安备 11010802033920号
EEWORLD
