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SE5535N

Part NumberSE5535N
CategoryAnalog mixed-signal IC    Amplifier circuit   
File Size2469.86,9 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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Part Number Manufacturer Description
SE5535N Ideal Semiconductor Inc Basic information about SE5535N amplifier:SE5535N is an OPERATIONAL AMPLIFIER.SE5535N amplifier core...

SE5535N Overview

Basic information about SE5535N amplifier:

SE5535N is an OPERATIONAL AMPLIFIER. Commonly used packaging methods are DIP, DIP8,.3

SE5535N amplifier core information:

The minimum operating temperature of the SE5535N is -55 °C and the maximum operating temperature is 125 °C. Its peak reflow temperature is NOT SPECIFIED Its maximum bias current at 25°C is: 0.08 µA Its maximum average bias current is 0.1 µA

How to simply check the efficiency of an amplifier? Looking at its slew rate, the SE5535N has a nominal slew rate of 15 V/us. The maximum slew rate of the SE5535N given by the manufacturer is 6.6 mA, while the minimum slew rate is 10 V/us. Its minimum voltage gain is 25000. When the op amp is used in a closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the frequency when the SE5535N gain becomes 0.707 times the low-frequency gain is 1000 kHz.

The nominal supply voltage of the SE5535N is 15 V, and its corresponding nominal negative supply voltage is -15 V. The input offset voltage of the SE5535N is 3000 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)

Related dimensions of SE5535N:

SE5535N has 8 terminals. Its terminal position type is: DUAL. Terminal pitch is 2.54 mm. Total pins: 8

SE5535N amplifier additional information:

SE5535N adopts the VOLTAGE-FEEDBACK architecture. It does not belong to the low offset class of amplifiers. The frequency compensation status of SE5535N is: YES. Its temperature grade is: MILITARY. The corresponding JESD-30 code is: R-PDIP-T8.

The corresponding JESD-609 code is: e0. The package code of SE5535N is: DIP. The materials used in the SE5535N package are mostly PLASTIC/EPOXY. The package shape is RECTANGULAR. The SE5535N package pin format is: IN-LINE.

Its terminal form is: THROUGH-HOLE.

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