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TLV2451IDBV

Part NumberTLV2451IDBV
CategoryAnalog mixed-signal IC    Amplifier circuit   
File Size18860.15,59 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Download Datasheet Parametric

Alternative parts

Part Number Manufacturer Description
TLV2451CDBV Texas Instruments OP-AMP, 2000uV OFFSET-MAX, 0.2MHz BAND WIDTH, PDSO5, PLASTIC, SOT-23, 5 PIN
TLV2451CDBVR Texas Instruments Single Micropower Rail-To-Rail Input/Output Op Amp 5-SOT-23 0 to 70
TLV2451CDBVT Texas Instruments Single Micropower Rail-To-Rail Input/Output Op Amp 5-SOT-23 0 to 70
TLV2451IDBVR Texas Instruments Single Micropower Rail-To-Rail Input/Output Op Amp 5-SOT-23 -40 to 125
TLV2451IDBVT Texas Instruments Single Micropower Rail-To-Rail Input/Output Op Amp 5-SOT-23 -40 to 125
TLV2451CDBVRG4 Texas Instruments Single Micropower Rail-To-Rail Input/Output Op Amp 5-SOT-23 0 to 70
TLV2451CDBVTG4 Texas Instruments Single Micropower Rail-To-Rail Input/Output Op Amp 5-SOT-23 0 to 70
TLV2451IDBVRG4 Texas Instruments Single Micropower Rail-To-Rail Input/Output Op Amp 5-SOT-23 -40 to 125
TLV2451IDBVTG4 Texas Instruments Single Micropower Rail-To-Rail Input/Output Op Amp 5-SOT-23 -40 to 125

TLV2451IDBV Overview

TLV2451IDBV放大器基础信息:

TLV2451IDBV是一款OPERATIONAL AMPLIFIER。常用的包装方式为PLASTIC, SOT-23, 5 PIN

TLV2451IDBV放大器核心信息:

TLV2451IDBV的最低工作温度是-40 °C,最高工作温度是125 °C。其峰值回流温度为NOT SPECIFIED25℃下的最大偏置电流为:0.005 µA他的最大平均偏置电流为0.007 µA

如何简单看一个放大器效率?看它的压摆率,TLV2451IDBV的标称压摆率有0.11 V/us。厂商给出的TLV2451IDBV的最大压摆率为0.035 mA,而最小压摆率为0.02 V/us。其最小电压增益为35000。而在运放闭环使用时,某个指定闭环增益(一般为 1 或者 2、 10 等)下,TLV2451IDBV增益变为低频增益的 0.707 倍时的频率为200 kHz。TLV2451IDBV的功率为NO。其可编程功率为NO。

TLV2451IDBV的标称供电电压为3 V,其对应的标称负供电电压为。TLV2451IDBV的输入失调电压为2000 µV(输入失调电压:使运算放大器输出端为0V(或接近0V)所需加于两输入端之间的补偿电压。)

TLV2451IDBV的相关尺寸:

TLV2451IDBV的宽度为:1.6 mm,长度为2.9 mmTLV2451IDBV拥有5个端子.其端子位置类型为:DUAL。端子节距为0.95 mm。共有针脚:5

TLV2451IDBV放大器其他信息:

TLV2451IDBV采用了VOLTAGE-FEEDBACK的架构。其不属于低偏置类放大器。其不属于低失调类放大器。TLV2451IDBV的频率补偿情况是:YES。其温度等级为:AUTOMOTIVE。

其属于微功率放大器。TLV2451IDBV不符合Rohs认证。其含有铅成分。其对应的的JESD-30代码为:R-PDSO-G5。TLV2451IDBV的封装代码是:LSSOP。

TLV2451IDBV封装的材料多为PLASTIC/EPOXY。而其封装形状为RECTANGULAR。TLV2451IDBV封装引脚的形式有:SMALL OUTLINE, LOW PROFILE, SHRINK PITCH。其端子形式有:GULL WING。座面最大高度为1.45 mm。

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