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TLV2721IDBV

Part NumberTLV2721IDBV
CategoryAnalog mixed-signal IC    Amplifier circuit   
File Size6109.7,28 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Download Datasheet Parametric

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TLV2721IDBV Overview

TLV2721IDBV amplifier basic information:

TLV2721IDBV is an OPERATIONAL AMPLIFIER from Texas Instruments. Commonly used packaging methods are PLASTIC, SOT-23, 5 PIN

TLV2721IDBV amplifier core information:

The minimum operating temperature of the TLV2721IDBV is -40 °C and the maximum operating temperature is 85 °C. Its peak reflow temperature is NOT SPECIFIED Its maximum average bias current is 0.00015 µA

How to simply check the efficiency of an amplifier? Looking at its slew rate, the nominal slew rate of TLV2721IDBV is 0.25 V/us. The maximum slew rate of the TLV2721IDBV given by the manufacturer is 0.2 mA, while the minimum slew rate is 0.05 V/us. Its minimum voltage gain is 1000. When the op amp is used in a closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the frequency when the TLV2721IDBV gain becomes 0.707 times the low-frequency gain is 480 kHz. The power of TLV2721IDBV is NO. Its programmable power is NO.

The nominal supply voltage of TLV2721IDBV is 3 V, and its corresponding nominal negative supply voltage is. The input offset voltage of the TLV2721IDBV is 3000 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)

Related dimensions of TLV2721IDBV:

The width of TLV2721IDBV is: 1.6 mm and the length is 2.9 mm. TLV2721IDBV has 5 terminals. Its terminal position type is: DUAL. Terminal pitch is 0.95 mm. Total pins: 5

TLV2721IDBV amplifier additional information:

TLV2721IDBV adopts the VOLTAGE-FEEDBACK architecture. It belongs to the low-bias class of amplifiers. It does not belong to the low offset class of amplifiers. The frequency compensation status of TLV2721IDBV is: YES. Its temperature grade is: INDUSTRIAL.

It is a micropower amplifier. TLV2721IDBV is not Rohs certified. It contains lead. The corresponding JESD-30 code is: R-PDSO-G5. The packaging code of TLV2721IDBV is: LSSOP.

The materials used for TLV2721IDBV packaging are mostly PLASTIC/EPOXY. The package shape is RECTANGULAR. TLV2721IDBV package pin forms are: SMALL OUTLINE, LOW PROFILE, SHRINK PITCH. Its terminal forms are: GULL WING. The maximum seat height is 1.45 mm.

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