PA13DP datasheet, PDF - EEWORLD Datasheet

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PA13DP: Part NumberPA13DP; CategoryAnalog mixed-signal IC Amplifier circuit; ManufacturerCirrus Logic; Websitehttp://www.cirrus.com

Alternative parts

Part Number	Manufacturer	Description
PA13	Apex Microtechnology Inc	IC opamp power 4mhz 12sip
PA13A	Apex Microtechnology Inc	IC opamp power 4mhz 12sip
PA13ADP	Cirrus Logic	Basic information of PA13ADP amplifier:PA13ADP is an OPERATIONAL AMPLIFIER. Commonly used packaging ...

PA13DP Overview

Basic information of PA13DP amplifier:

PA13DP is an OPERATIONAL AMPLIFIER. Commonly used packaging methods are, SIP12,.16TB

PA13DP amplifier core information:

The minimum operating temperature of PA13DP is -55 °C and the maximum operating temperature is 125 °C. Maximum bias current at 25°C: 0.03 µA Maximum average bias current is 0.03 µA

How to simply check the efficiency of an amplifier? Looking at its slew rate, the nominal slew rate of PA13DP is 4 V/us. The maximum slew rate of PA13DP given by the manufacturer is 50 mA, while the minimum slew rate is 2.5 V/us. Its minimum voltage gain is 63000. When the op amp is used in closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the frequency when the PA13DP gain becomes 0.707 times the low-frequency gain is 4000 kHz. The power of PA13DP is YES.

The nominal supply voltage of PA13DP is 40 V, and its corresponding nominal negative supply voltage is -40 V. The input offset voltage of PA13DP is 6000 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)

Related dimensions of PA13DP:

PA13DP has 12 terminals. Its terminal position type is: SINGLE. Terminal pitch is 2.54 mm. Total pins: 12

PA13DP amplifier additional information:

PA13DP adopts the VOLTAGE-FEEDBACK architecture. It does not belong to the low offset class of amplifiers. The frequency compensation status of PA13DP is: YES. Its temperature grade is: MILITARY. The corresponding JESD-30 code is: R-XSFM-T12.

The materials used in PA13DP packaging are mostly UNSPECIFIED. The package shape is RECTANGULAR. The pin forms of PA13DP package are: FLANGE MOUNT. Its terminal form is: THROUGH-HOLE.

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