The packaging and testing market will reach US$25.5 billion in 2008

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The packaging and testing market will reach US$25.5 billion in 2008 [Copy link]

The packaging and testing market will reach US$25.5 billion in 2008

(China Electronics News)

Zhou Yanwu, Research Director of Shuiqingmuhua 2006-6-20

According to forecasts, the global IC packaging and testing market will continue to grow from 2002 to 2008, with a compound growth rate of 9.4%. The annual revenue of IC packaging and testing will increase from US$13.37 billion in 2002 to US$25.5 billion in 2008. The market size in 2005 was approximately US$18.1 billion. The driving mainly comes from the fact that large IDM manufacturers outsource more and more IC packaging and testing. The outsourcing ratio reached 50% in 2004 and is expected to reach 63% in 2007. 　　Six of the top 10 packaging and testing companies in the world are Taiwanese companies. In 2005, the packaging and testing industry showed a situation where the strong became stronger. The strong had huge production capacity to reduce costs and sufficient profits to increase investment in technology research and development, ultimately forming stronger competitiveness. The growth rate of the top five packaging and testing companies exceeded 20%, showing that the packaging and testing industry has strong vitality and is a high-growth industry , and the ranking has remained unchanged for three consecutive years. There are relatively big changes outside the fifth place, with three new faces entering the top 10. Shinko of Japan, which ranked sixth in 2004, withdrew from and fell out of the top 10. CARSEM, ranked seventh, fell to ninth. ASAT of Hong Kong, China, ranked eighth in 2004 and fell out of the top 10 in 2005. Huatai, ranked ninth, also fell out of the top 10. Chaofeng still remains in the top 10. 　　In terms of profit, all Taiwanese manufacturers in China have made a lot of money, because Taiwan Province of China has gathered the most complete IC industry chain in the world. Whether it is customer acquisition or cost control, the competitiveness is not something that companies outside Taiwan Province can compete with. 　　The packaging and testing industry is highly concentrated, with the top 10 occupying about 60% of the market. The total revenue of the top 10 in 2005 was US$9.1 billion, and the revenue of the top two accounted for 51%. The revenue of the first place is 5 times that of the fifth place and 12 times that of the tenth place. 　　The technology of the packaging and testing industry is developing rapidly, and a large amount of funds are needed for research and development. For companies with tight cash flow, it is difficult to operate. The packaging and testing industry is showing a situation where the big ones will always be big, and small companies will be eliminated. As a result, the packaging and testing industry has been constantly merged. The world's largest packaging and testing factory has experienced four mergers and acquisitions. In 1990, ASE acquired Singapore's Forray Electronics, in 1999, it acquired the US testing factory ISELab, and in the same year it acquired two Motorola factories. In 2004, it acquired . Mergers and acquisitions are one of the main driving forces for ASE's growth. Through mergers and acquisitions, it quickly acquired production capacity, technology and orders, and finally became the world's largest packaging and testing group. 　　The second place AMKOR is also constantly acquiring mergers and acquisitions. In 2002, it acquired Citizen's semiconductor assembly business and Fujitsu's chip packaging business. In May 2004, Amkor bought the land and 88,000 square meters of production facilities leased by IBM Packaging and Testing in Shanghai. The transaction amount is about 145 million US dollars, including 114 million US dollars of land, buildings and ancillary equipment and 31 million US dollars of equipment and intangible assets . In Japan, AMKOR ended its joint venture with Toshiba, and Amkor bought the factory and operated it on its own; in Taiwan, it acquired Zhongjing and Youli Semiconductor; in Singapore, it bought IBM's test plant. 　　The packaging and testing industry in mainland China may also undergo relatively large changes in 2006. As we all know In order to protect its own interests, Taiwan Province has long restricted the westward expansion of the packaging and testing industry, and many packaging and testing manufacturers are waiting for the Taiwan authorities to open up. However, foreign packaging and testing manufacturers have been conquering the mainland on a large scale, causing extreme dissatisfaction among manufacturers in Taiwan Province. The Taiwan authorities have also realized that this can only benefit foreign packaging and testing manufacturers. On April 27 this year, Taiwan's economic department announced the conditional lifting of the ban on low-tech packaging and testing businesses, limited to traditional wire bonding packaging and its corresponding electrical testing, including DIP, PLCC, QFC, PBGA and SO, etc. High-tech flip chip packaging and testing businesses are still absolutely prohibited. 　　DIP, QFC, PLCC are the types of packaging and testing that mainland packaging and testing companies mainly carry out. It seems that Taiwan companies may have an impact on mainland companies, but in fact, they do not interfere Mainland packaging and testing companies mainly serve mainland companies, while Taiwan companies serve foreign companies. Mainland packaging and testing companies have a close cooperative relationship with their customers and will never change the cooperative relationship due to price or other reasons. In the field of high-tech packaging and testing, the mainland urgently needs to strengthen its strength .

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