Summary of comprehensive standards for electronic components

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Summary of comprehensive standards for electronic components [Copy link]

G4210 "GB/T4210-2001 Electrical Terminology: Electromechanical Components for Electronic Equipment" G5597 "GB/T5597-1999 Test Method for Microwave Complex Permittivity of Solid Dielectrics" G16523 "GB/T16523-1996 Specification for Round Quartz Glass Photomask Substrate" G16524 "GB/T16524-1996 Specification for Photomask Alignment Mark" G16525 "GB/T16525-1996 Plastic Leaded Chip Carrier Package Lead Frame Specification" G16526 "GB/T16526-1996 Package Lead Inter-Lead Capacitance and Lead Load Capacitance Test Method" G16527 "GB/T16527-1996 Hard Surface Photosensitive Plate Photoresist and Electron Beam Resist Specification" G16595 "GB/T16595-1996 Wafer General Grid Specification" G16596 "GB/T16596-1996 Wafer Coordinate System Determination Specification" G16879《GB/T16879-1997 Criteria for the Expression of Precision and Accuracy of Mask Photolithography Systems》 G16880《GB/T16880-1997 Criteria for the Classification and Size Definition of Photomask Defects》 G17564.1《GB/T17564.1-2005 Standard Data Element Types and Related Classification Schemas for Electrical Components: Definitions-Principles and Methods》 G17564.2《GB/T 17564.2-2005 Standard Data Element Types and Related Classification Schemas for Electrical Components: EXPRESS Dictionary Schema》 G17564.3 "GB/T17564.3-1999 Standard data elements for electrical components: Maintenance and verification procedures" G17564.4 "GB/T17564.4-2001 Standard data element types and related classification schemes for electrical components: A benchmark set of IEC standard data element types, component categories and items" G17564.5 "GB/T17564.5-2007 Standard data element types and related classification schemes for electrical components: EXPRESS dictionary schema extension" G17866 "GB/T17866-1999 Special defect masks and evaluation used in mask defect inspection sensitivity analysis" G18501.1 "GB/T18501.1-2001 Quality-Assessed DC and Low-Frequency Analog and Processing Connectors: General Specification" G18501.2 "GB/T18501.2-2001 Quality-Assessed Circular Connectors Sectional Specification" G19405.1 "GB/T19405.1-2003 Surface Mount Technology: Standard Method for Specification of Surface Mount Components" G19405.2 "GB/T19405.2-2003 Surface Mount Technology: G19921 "GB/T19921-2005 Test method for surface particles of polished silicon wafers" G19922 "GB/T19922-2005 Non-contact standard test method for local flatness of silicon wafers" G21194 "GB/T21194-2007 General requirements for reliability of optoelectronic devices used in communication equipment" G22586 "GB/T22586-2008 Microwave surface resistance test of high temperature superconducting films" G22587 "GB/T22587-2008 Measurement of the volume ratio of matrix to superconductor Measurement of the copper-superconductor volume ratio of Cu/Nb-Ti composite superconductors" GJ35 "GJB/Z35-1993 Component Derating Criteria" GJ221 "GJB/Z221-2005 Implementation Guidelines for Leak Detection Methods for Military Sealed Components" GJ360B "GJB360B-2009 Test Methods for Electronic and Electrical Components" GJ546B "GJB546B-2011Z Outline for Quality Assurance of Electronic Components" GJ548B "GJB 548B-2005 Microelectronic Device Test Methods and Procedures" GJ978 "GJB978A-1997 General Specification for Single-row and Double-row Plug-in Electronic Component Sockets" GJ2649 "GJB2649-1996 Military Electronic Component Failure Rate Sampling Plan and Procedure" GJ2650 "GJB2650-1996 Microwave Component Performance Test Method" GJ2823 "GJB2823-1997 Method for Assessing the Average Quality Level of Electronic Components" GJ3014 "GJB 3014-1997 Statistical Process Control System for Electronic Components" GJ3243 "GJB/Z3243-1998 Surface Mounting Requirements for Electronic Components" GJ3404 "GJB3404-1998 Requirements for the Management of Selection of Electronic Components" GJ4027A "GJB4027A-2006Z Destructive Physical Analysis Methods for Military Electronic Components" GJ4041 "GJB 4041-2000 Quality Control Requirements for Aerospace Electronic Components" GJ5397 "GJB 5397-2005 Specification for High-Strength Air-Getting Heater Components" GJ5422Z "GJB5422-2005Z Measurement Method for Gamma-ray Cumulative Dose Effect of Military Electronic Components" GJ5438Z "GJB5438-2005Z General Specification for Semiconductor Optoelectronic Device Housing" GJ5914K "GJB 5914-2006K Destructive Physical Analysis Methods for Military Semiconductor Devices of Various Quality Grades" GJ7243Z "GJB7243-2011Z Technical Requirements for Screening of Military Electronic Components" QJ1317 "QJ 1317A-2005 Electronic Component Failure Classification and Code" QJ1556B "QJ1556B-2008 Component Quality Reliability Information Collection Card Filling Regulations" QJ2227A "QJ 2227A-2005 Aerospace Components Effective Storage Period and Overdue Reinspection Requirements" QJ2671 "QJ2671-1994 Imported Electronic Components Quality Management Requirements" QJ3058 "QJ3058-1998 Component Review Management Requirements" QJ3065.1《QJ3065.1-1998 Requirements for the Management of Component Selection》 QJ3065.2《QJ3065.2-1998 Requirements for the Management of Electronic Component Procurement》 QJ3065.3《QJ3065.3-1998 Requirements for the Management of Component Supervision and Acceptance》 QJ3065.4《QJ3065.4-1998 Requirements for the Management of Component Screening and Re-inspection》 QJ3065.5《QJ3065.QJ3152 "QJ 3152-2002 Management Requirements for New Space Electronic Components" QJ3172 "QJ 3172-2003 Technical Requirements for Installation of Microwave Components" QJ3179 "QJ 3179-2003 Management Requirements for Destructive Physical Analysis of Components" QJ10002 "QJ10002-2008 Guidelines for Screening of Space Components" QJ10003 "QJ10003-2008 "Guide to Screening Imported Components" SJ10494 "SJ/T10494-1994 CS (CK) 635 Concentric Plug and Socket" SJ10495 "SJ/T10495-1994 CS (CK) 25, CS (CK) 35 Concentric Plug and Socket" SJ10496 "SJ/T10496-1994 P-type Plug and Socket" SJ10497 "SJ/T10497-1994 Bayonet Small Round Plug and Socket" SJ10498 "SJ/T10498-1994 FX16-7 waterproof circular plug socket" SJ11126 "SJ/T11126-1997 Phenolic encapsulation materials for electronic components" SJ11153 "SJ/T11153-1999 PQ core size series made of magnetic oxides" SJ11165 "SJ/T11165-1998 Blank detailed specification for PIN-FIT modules for optical fiber systems" SJ11215 "SJ/T11215-1999 General specification for automatic taping machines for electronic components" SJ11275 "SJ/T11275-2002 General Specification for Horizontal Liquid Phase Epitaxy System"