Ultra-small CSP SAW filter

fighting

Ultra-small CSP SAW filter [Copy link]

Temex Co., Ltd. of France released an ultra-small RF SAW filter at the 3GM exhibition in Cannes, France in 2003. This product uses SMD packaging technology to meet customers' demand for miniaturization and high performance, and is suitable for the new generation of mobile phone products. 

The new RF SAW filter launched by Temex supports the following standards: GSM850/900/1800/1900, CDMA450, CDMA2000, PCS, W-CDMA, GPS, 802-11 b/g and Bluetooth. Due to the use of innovative SMD packaging technology, the package size of this product is 2.0 X 1.4 X 0.82mm. At the same time, the product has a well-balanced output and improved signal sensitivity. The product is also compatible with lead-free (high temperature) reflow soldering technology and has good moisture resistance, shock resistance, high temperature resistance and other functions. Temex has now begun mass production of 2.0mm X 1.4mm CSP SAW filter products.