BGA Rework

henryyuan

BGA Rework [Copy link]

Retronix China provides the following services: www.retronix.com

1. Pressure-free laser reballing service to solve the BGA rework problem of stacked packaging.

2. DEBUG whole board repair service, disassembly and installation of BGA components, etc. (PCBA Rework)

3. BGA testing services, 3D appearance testing and functional testing, etc.

4. Packaging services, tape, reel, or tube, etc.

5. PCB pad repair

Henry
yuan 13428792720

mr_yuan_cheng@163.com

henry.yuan@retronix.com.cn

http://www.retronix.com

fangzeng1

Model: ES-F400
Features: ES-F400 is suitable for BGA chip implantation, with good thermal stability, good solderability, less residue and bright solder joints. For small-sized solder balls (such as 0.30mm), solder ball soldering is not easy to occur during reflow soldering. For small-sized BGA solder balls, infrared heating or heating plate heating should be used, otherwise soldering is likely to occur.
Model: ES-F600A
Features: ES-F600A is suitable for BGA chip disassembly and repair soldering, suitable for tinning and repair soldering of components. When the hot air gun is blown, there is little smoke, no irritating odor, less residue, and no cleaning is required. When soldering BGA chips, the tinning speed is fast, the welding efficiency is high, and the reliability is high.
Tel: 13714319585
　　　　　　　　　　　　　　Fax: 0755-26814758
　　　　　　　　　　　　　　Contact: Zeng Fang
　　　　　　　　　　　　　　E-mail: fang.zeng@126.com