4133 views|0 replies

1148

Posts

0

Resources
The OP
 

New technology for analyzing tire reinforcement material status and predicting cavity resonance is introduced [Copy link]

Yokohama Rubber has developed a technology to analyze the state of tire reinforcement materials and predict tire cavity resonance sound, aiming at the tire's basic technology "MultiScale Simulation".
The object of dynamic analysis is the state of carbon black and silica (SILICA) contained in the reinforcement materials during vehicle driving. The state of the tire reinforcement materials can be analyzed as if observing a point with a microscope, and the influence of the proportion and structure of the reinforcement materials on the characteristics of the tire can be analyzed. In this way, tire performance with opposite performance characteristics such as dynamic impedance and wet skid performance can be controlled with high precision.
This technology was developed in cooperation with Tohoku University in Japan using nonlinear homogenization analysis. The development of a new technology that can significantly shorten the calculation time and use general nonlinear finite element analysis software has made it possible to predict the state inside the mixed material.
Cavity resonance refers to the noise emitted when a vehicle drives on a bumpy road or passes through a road joint. Previously, it was impossible to calculate the changes in the state of air in the tire while the vehicle is driving, and it could only be calculated when the vehicle is stationary. When driving, the resonance frequency varies depending on the speed and driving direction, and the new technology enables detection in these states.
The company said that it is currently discussing tires using the new technology. It is possible to achieve the quieting effect through the tire itself, or it is possible to add a material similar to the special sound-absorbing sponge produced by Sumitomo Rubber.
This post is from Automotive Electronics

Just looking around
Find a datasheet?

EEWorld Datasheet Technical Support

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号
快速回复 返回顶部 Return list