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IGBTs and MOSFETs integrated in power modules are key components of today's power electronic circuits and their application range is constantly expanding into new areas. At the same time, the demand for rectifier diodes and thyristors as a cost-effective way to connect circuits to the power grid is also growing. This application note is intended to support users in the selection and use of such devices.
This handbook contains basic semiconductor background knowledge to give readers a better understanding of application possibilities and application limitations. Packaging and assembly technology are the main factors affecting module performance and field application limitations, and this is explained in depth. Reliability data, life cycle analysis and key test processes are also discussed. This application handbook also explains the data sheet structure and provides comments to help users better understand the data sheet parameters.
The book covers detailed application-related information including: electrical configuration under critical operating conditions, semiconductor drivers and protection components; determining thermal sizing and cooling, parallel and series connection tips, assembly tips for optimized power layout with parasitic components, and requirements under specific environmental conditions.
To help with component selection and design work. Combining valuable professional experience with detailed practical knowledge, the book summarizes a large amount of essential information from various papers and expert opinions to date.
https://download.eeworld.com.cn/detail/luojiangjun/628838
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