Award-winning live broadcast | Keysight's "New Technologies in the AI Boom" Lecture Series

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Award-winning live broadcast | Keysight's "New Technologies in the AI Boom" Lecture Series [Copy link]

In recent years, AI has been developing rapidly, and related new technologies have been emerging. What are the future trends? What are the solutions? Keysight sincerely invites you to participate in the "New Technologies in the AI Boom" series of lectures. Come and join this exciting journey of learning and growth!

Upcoming live broadcasts:

Session 3: A brief discussion on the next generation of optoelectronic packaging CPO specifications and testing solutions

Live broadcast time: December 27 (Wednesday) 14:00-16:00

Session 4: Next-generation PCIE5.0/6.0 technology trends and testing challenges

Live broadcast time: 14:00-16:00, January 19, 2024 (Friday)

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Participation benefits: Participate in the live broadcast and submit the questionnaire on site to participate in the lucky draw, and have a chance to win lucky draw gifts provided by Keysight Technologies

Note: You have the chance to win prizes in every live broadcast~

Live broadcast related :

Session 3 : A brief discussion on the next generation of optoelectronic packaging CPO specifications and testing solutions

Date: December 27, 2023 (Wednesday) 14:00-16:00

Content introduction: With the global AI arms race in full swing this year, the rise of technologies such as ChatGPT has greatly stimulated the demand for cloud computing and data centers. In particular, the AI computing power has exceeded expectations, driving a surge in demand for high-speed optical modules.

The high bandwidth demand of next-generation data centers directly challenges space and size, making pluggable technology interconnection difficult. On-board optics (OBO) and co-packaged optics (CPO) have come into the public eye. In this seminar, we invited the head of optical communications at Keysight Technologies and technical experts from the ODCC Association to explain CPO technology and test specification prospects.

Session 4 : Next-generation PCIE5.0/6.0 technology trends and testing challenges

Date: Friday, January 19, 2024, 14:00-16:00

Content introduction: The era of big models has arrived. AI big model technology is maturing rapidly and entering the trillion-parameter era. The requirements for AI computing power performance are getting higher and higher, which is reflected in the interconnection between cards within the nodes of the computing system and the network interconnection between nodes. The underlying layer of high-speed interconnection is PCIE, and the technical iteration and implementation of PCIE are urgent. With the continuous iteration of PCIE, it also provides technical support for memory decoupling in the era of large memory. CXL has supported it in the technical system since PCIE5.0. CXL is based on PCIE at the bottom layer, which is introduced in detail.

register now