Sichuan SMD Processing Factory_Brief Introduction of Tin Beads

四川英特丽

Sichuan SMD Processing Factory_Brief Introduction of Tin Beads [Copy link]

Sometimes, some production and processing defects may occur due to various reasons during the production and processing of SMT. Solder beads are one of the more common ones. The main manifestation is that small spherical or dot-shaped solder appears on the pad or other places after the SMT patch processing is completed. If it is not handled in time according to the production requirements, it may affect the service life and reliability of the board. The following Sichuan Yingteli Electronic Technology will briefly introduce the common causes and solutions of solder bead formation.
1. Formation causes
1. Induction deposition
Solder balls may form on the PCB during the welding heating process. The main reasons are the instability of the molten pool and the temperature inconsistency of the circuit board. When the induction heating in the circuit board is too high, the melting point of the pad or the back metal layer will be reduced, resulting in the formation of solder beads.
2. Involvement
Deformation or dislocation of the PCB during the production and processing may cause the solder to enter the wrong position.
3. Solder rework
Circuit boards often need to be reworked during the SMT process. If the rework is not done properly, solder beads will appear on the pad.
2. Solutions
1. Mechanical treatment
This is the most commonly used treatment method in Sichuan Yingteli, usually using a tin sucker and solder silver wire for treatment. 2. Optical inspection and infrared microscope inspection
For problems that cannot be solved by mechanical treatment, optical inspection or infrared microscope can usually be used to check the position and shape of solder balls.
3. Strengthen control and inspection
Strengthening control and inspection is the best way to prevent the formation of solder balls in SMT production.