A brief introduction to SMT patch quality inspection
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In order to achieve reliable pass rate and quality in the production process of SMT patch processing, it is an indispensable method to arrange quality inspection in each link. The following Guangzhou patch processing factory Pet Electronics will briefly introduce some quality inspections in the SMT patch and welding process.
Common quality inspections in SMT factories include incoming material inspection, process inspection, surface assembly inspection, etc. Incoming material inspection is carried out before production. The impact of problems found in the incoming material inspection on production is also minimal. Only unqualified components, PCBs, solder paste and other production materials need to be replaced.
Quality problems found in process inspection need to be corrected in time in the production link and the boards with quality problems need to be reworked. Since the repair after welding needs to be welded from the beginning, in addition to working time and materials, parts and circuit boards will also be damaged. According to defect analysis, the quality inspection process of SMT patch processing can reduce the defect rate and scrap rate, reduce the cost of rework and maintenance, and avoid quality hazards from the source.
Common quality inspection contents are mainly whether the surface of the solder joint is smooth, whether there are holes, etc., whether the solder joint is crescent-shaped, whether there are more tin or less tin, and whether there are defects such as monuments, bridges, part movement, missing parts, and solder beads. Check whether there are defects such as short circuits and cold solder joints in the welding process, and check for color changes on the surface of the printed circuit board.
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