Countdown to registration | Keysight | ICisC High-Speed Chip Test Technology Seminar[Copy link]
Meeting Name:
Keysight | ICisC High-Speed Chip Test Technology Seminar (Nanjing Special)
Meeting time:
13:00-17:30, July 10, 2023
Meeting Location:
Building 4, No. 1 Huafu Road, Jiangbei New District, Nanjing, China Integrated Circuit National Core Fire Platform
Conference Introduction:
This seminar was jointly organized by Keysight and Nanjing Integrated Circuit Industry Service Center (ICisC) . It aims to explore the current hot semiconductor technologies, semiconductor industry development and high-speed chip testing methods. The content covers the computing chips and interconnection technologies behind application scenarios such as AIGC and ChatGPT, including high-speed bus technologies PCIe 5.0/6.0/CXL, storage technologies DDR5 and LPDDR5/6, etc.; key technologies for high-speed data centers, including co-packaged optics (CPO) technology, etc.
During the roundtable discussion, leaders and experts from chip industries including enterprises, ICISC, and Keysight Technologies were invited to discuss the current status and new technologies of the integrated circuit industry and share their unique perspectives.
Participants will also visit Nanjing ICisC and have further communication and exchanges with experts in the field of chip testing. Welcome to sign up and participate. Participants will receive a beautiful gift.
Topic: Visit to Nanjing ICISC and Chip Testing Laboratory
Introduction: Visit Nanjing ICIsC and chip testing laboratory.
14:00-14:30
Topic: Welcome Speech
Unit: Nanjing ICIsC & Keysight Technologies
Introduction: Speech by relevant leaders from Nanjing Integrated Circuit Industry Service Center (ICisC) and Keysight Technologies, and introduction to the ICIsC high-speed chip testing platform.
14:30-14:50
Topic: Sharing of the world's leading chiplet architecture AI chips and product solutions
Introduction: The AIGC wave brought by ChatGPT has increased the demand for computing power. Interconnecting multiple chips or acceleration cards through a high-speed bus is an effective way to improve computing power. This topic will explore the interconnection and storage-related testing technologies of computing power chips, including PCIe 5.0/6.0, CXL/UCIe, DDR/LPDDR.
Introduction: Introduces the latest technological advances in silicon photonic chips and optoelectronic integration solutions for silicon photonic chips.
15:30-15:50
Topic: Optical chip and optical module testing challenges
Introduction: Mainstream data center networks currently use 400G, and the industry's demand for 800G is increasing day by day. Challenges such as the "power wall" have also spawned technologies such as CPO to reduce the power consumption of optical modules. This topic will introduce Keysight's testing technology for optical chips/optical modules and 800G data centers.
15:50-16:00
Coffee break
16:00-17:00
Topic: Roundtable Forum
Unit: Specially invited industry guests
Introduction: Invite relevant leaders and technical experts from the integrated circuit industry to share and discuss the current development trends and industry overview of the chip industry.
17:00-17:30
Topic: Practical training on testing instrument technology
Unit: Nanjing ICIsC & Keysight Technologies
Introduction: Basic training on chip testing equipment.
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