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SONY ICD-SX2000 Voice Recorder Disassembly [Copy link]

This post was last edited by littleshrimp on 2022-7-27 10:53

ICD-SX2000 is a low-end voice recorder from SONY, with 16G internal storage, TF card expansion, dual microphones with adjustable angles, Bluetooth and NFC communication, and the current online price is less than 2,000 yuan. I saw this voice recorder on a certain website, and it must have been dropped and seriously damaged, with the microphone protection railing broken and the power button malfunctioning. You need to plug the USB into the power supply to turn it on. After turning it on, it can be operated but there is no sound when recording.

This is a photo posted by a fish seller:

After disassembling it, I found that not only the outer shell was damaged, but the circuit was also seriously damaged. The most amazing thing was the FPC connector on the microphone expansion board. Its soldering pad had been severely deformed. I have never figured out what kind of external force could have caused it to become like this.

In addition to soldering two built-in microphones, the microphone expansion board also supports external microphone input through a 3.5MM plug. There is a chip next to the interface that no information can be found. It is speculated that it is a microphone preamplifier chip.

In addition to the microphone expansion board you just saw, there are two other circuit boards, a blue main board and a green keyboard expansion board. There is a Bluetooth chip in the lower right corner of the keyboard expansion board, and its antenna is on the edge of the board.

There are no components on the back of the keyboard expansion board.

There is a USB port that can be slid out on the lower right corner of the back.

On the right side of the picture below is an ON Semiconductor LC823450, a chip for audio processing and the core of the entire voice recorder.

LC823450 has two Cortex-M3 cores and one of ON Semiconductor's own DSP cores, LPDSP32, integrated 1.6M SRAM, and supports MP3 codec and USB HS. LC823450-D.pdf (1.21 MB, downloads: 1)

The two CSP packaged chips below are Dialog's (acquired by Renesas) DA7211, a stereo codec. REN_da7211_datasheet_3v1_DST_20190206_1.pdf (1.59 MB, downloads: 1)

Below are the parameters and block diagram of DA7211:

The memory uses Samsung's KLMAG1JENB, a 16G eMMC chip

The firmware of LC823450 is stored in a winbond 16Mb FLASH chip. 25q16.pdf (339.47 KB, downloads: 1)

On the left are two crystal oscillators and the corresponding clock divider chip JRC's NJU6311. NJU6311_JRC.pdf (49.83 KB, downloads: 4)

Near the microphone expansion board connector is a JRC NJM2732, a dual-channel amplifier.

The chip with the silkscreen PH4QCA below is TI's TCA6416A, a low-voltage 16-bit I2C and SMBus I/O expander with voltage conversion, interrupt output, reset input and configuration registers. tca6416a.pdf (2.34 MB, downloads: 2)

In addition to the above chips, there are some chips whose specific models cannot be found through silk screen printing, such as the Bluetooth chip on the keyboard expansion board.

There is also this CSP packaged chip with the silkscreen D3774.

ICD-SX2000 integrates two electret microphones "trapped" in an iron cage.

I don't know much about audio, so I don't know how big the difference is between a professional voice recorder like this and a mobile phone recording. After a simple repair, this voice recorder can record now. I compared it with the mobile phone recording. Except for its higher sensitivity, I can't hear how much better its tone is compared with the mobile phone. Maybe it was broken and not completely repaired, or it may be because of my ears. In comparison, I feel that the recording function of the mobile phone is also very good. If you think that the MEMS microphone in the mobile phone is not ideal, can you solve it by plugging in an electret? Of course, there is definitely something wrong with my idea. If everyone thinks this way, there is no need for this kind of voice recorder to exist. Friends who understand it, please give me some advice.

Here is its disassembly process:


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