Memory Technology Suzhou R&D Center needs back-end PR/IC verification/DFT/FPGA
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Memory Technology Suzhou needs back-end PR engineers, IC verification engineers, DFT engineers, FPGA engineers. Recommendations and self-recommendations are welcome. For recommendations, please contact maqiao@ramaxel.com WeChat: 1042746432
IC back-end senior/senior engineer
Job Responsibilities:
1. Independently complete PR/STA/PV work of digital backend block
2. Independently complete full chip FloorPlan, Power, Clock&Reset and other tasks
3. Cooperate to complete DFT, ECO, Power analysis and other related work
Job requirements:
1. Education and major: Bachelor degree or above, major in microelectronics, circuit system and other related majors
2. Work experience: Bachelor degree more than 5 years, Master degree more than 3 years
3. Professional ability:
A. Proficient in ICC, starrc, calibre and other backend tools
B. Familiar with the entire flow from Netlist to layout output;
C. Familiar with scripting languages such as csh, Tcl, Perl, etc., and have strong scripting skills
D. Have relevant experience in back-end design of 28nm and below processes
E. Have relevant experience in SOC chip mass production
F. Experience in back-end design of high-speed interfaces such as HDMI, DDR, PCIE, SATA, USB, etc. is preferred
G. Familiar with DFT knowledge and relevant experience is preferred
H. Familiarity with CPF and UPF low power consumption processes is preferred
(Senior) IC Verification Engineer
Job Responsibilities:
1. Complete the functional verification of the delivery module, including pre-simulation and post-simulation;
2. Assist hardware and testing colleagues to complete FPGA testing;
3. Participate in the construction of the entire chip verification environment and participate in the verification of the entire system;
Job requirements:
1. Education and major: Bachelor degree or above, major in microelectronics, circuit system or related majors
2. Work experience: Bachelor degree more than 4 years, Master degree more than 2 years
3. Professional ability:
(1) More than 2 years of experience in chip verification;
(2) Proficient in Verilog, SV, C/C++ languages;
(3) Proficient in using mainstream EDA simulation tools such as VCS, NC-Verilog, modelSim, etc.; Proficient in using version control tools such as SVN;
(4) Be familiar with chip verification process and UVM verification methodology, and be able to use UVM to build chip module and system-level verification platforms;
(5) Proficiency in scripting languages such as Perl/Python;
(6) Familiarity with AMBA and other buses, and familiarity with SOC systems, PCIe, Nand Flash Controller, Nvme, SSD and other storage systems is a plus
DFT Engineer
Job Responsibilities:
IC DFT Design
Job requirements:
1. Education and major: Bachelor degree or above, major in microelectronics, circuit system and other related majors
2. Work experience: more than 3 years
3. Professional ability: Familiar with DFT processes such as mbist, scan, jtag, etc., with synthesis and simulation experience; have DFT tapout experience.
4. Comprehensive quality: honesty, trustworthiness, strong sense of responsibility, and team spirit
FPGA Engineer
FPGA Design Engineer/SoC Design Engineer
Job Responsibilities:
1 Participate in RTL design, including clock, reset, interrupt, IO logic, debugging and tracing;
2 Undertake the system SOC-level integrated design and development tasks, integrated verification, and the construction of software and hardware collaborative verification environment;
3. Build and develop a reusable platform environment and develop an FPGA/RTL integrated design simulation platform system.
Job requirements:
1 Bachelor degree or above in microelectronics, circuit system or related majors
2 Familiar with ARM, DMA, DDR controller
3. Familiar with AMBA bus protocol, relevant Linux development experience is preferred
4 Familiarity with the structure of storage chips such as SSD and eMMC is a plus
5 Comprehensive quality: strong teamwork and integrity
About memory:
Memory Technology is a company engaged in the development of storage and module products, including memory (DRAM) modules , solid-state drives ( SSDs ) and secure embedded products. The company has a complete semiconductor industry chain system from chip planning, design, to packaging, SMT , and test design and development. It is the largest module manufacturer and top storage product developer in China. Among them, memory products have ranked first in the domestic market share for 18 consecutive years, and the production and sales of SSD (solid-state storage) and secure storage are leading the country.
Based in Shenzhen, Memory has four R&D centers in Beijing, Shanghai, Suzhou and Dongguan, with first-class material laboratories, compatibility laboratories, reliability testing and analysis laboratories, signal laboratories, FPGA and chip debugging laboratories, storage system testing laboratories, etc. At the same time, it has two modern manufacturing bases in Dongguan and Huizhou, covering an area of more than 20,000 square meters, with world-leading Memory chip packaging and testing technology and dozens of world-class fully automated high-speed SMT production lines.
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