Forum»Forum › Mobile and portable › Design and implementation of mobile multimedia commu ...

5857 views|0 replies

293 Posts	0 Resources

The OP

Published on 2006-8-31 06:53 Only look at the author

Design and implementation of mobile multimedia communication terminal based on OMAP1510 dual-core architecture [Copy link]

This post was last edited by jameswangsynnex on 2015-3-3 19:59

When developing multimedia applications, you can use the multimedia engine through the standard multimedia application programming interface (MM API), which facilitates application development; the multimedia engine uses the DSP/BIOS bridge for related DSP tasks through the DSP application programming interface (DSP API); finally, the DSP/BIOS bridge coordinates data, I/O flow and DSP task control.

3265.pdf

388.54 KB, downloads: 10

This post is from Mobile and portable

Return list

Just looking around

I opened BOSS and saw a lot of job openings in Shenzhen.
Iwasboredtonight,soIaccidentallyopenedBOSSDirectRecruitmentandtookalookIsitthattheelectronicsindustryinGuangzhouisdyingoutHowever,nomatterwhat,itisnoteasytofindajob-hoppingpositionwithsuitableworkcontent,satisfactorysalaryandclosetohome
Delphi multi-format image display
Programming Problems of Two-Bit 595 Driving 8-Bit Common Cathode Digital Tube
How to achieve aperture tuning
Black Gold's FPGA is really bad
Mitsubishi, Siemens (PLC) Delta, Mitsubishi, Siemens (touch screen) programming software
LSM6DSL reads data from STM32L4R5 interrupt method
Technical parameters of automotive sensors

Find a datasheet?

EEWorld Datasheet Technical Support

Hot tag

Related articles more>>

It is reported that Kioxia will be approved for listing as early as tomorrow, and its market value is expected to reach 750 billion yen
On November 21, Reuters reported that with the support of Bain Capital, Kioxia will obtain approv
The US government finalizes a $1.5 billion CHIPS Act subsidy to GlobalFoundries to support the latter's expansion of production capacity in the US
On November 21, the U.S. Department of Commerce officially announced yesterday that it will provi
SK Hynix announces mass production of the world's highest 321-layer 1Tb TLC 4D NAND flash memory, plans to ship it in the first half of 2025
On November 21, SK Hynix just announced that it has started mass production of the world's highes
UWB is a new way to use it in cars. Can wireless BMS also use it?
Filling the domestic gap! China Mobile, Huawei and others jointly released the first GSE DPU chip
Samsung Electronics NRD-K Semiconductor R&D Complex to import ASML High NA EUV lithography equipment
Apple reveals the secret of its own chip success: competitors can't use the latest cutting-edge technology
A big chip war is about to start: Qualcomm and MediaTek are involved in notebooks, and AMD is reported to enter the mobile phone market
Exynos 2600 chip is the key, Samsung is reportedly going to launch a 2nm chip counterattack
TSMC once said that Huawei could not catch up! TSMC is far ahead in process technology, and has already attracted major customers to grab orders before mass production of 2nm

New Posts

Featured

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

About Us Customer Service Contact Information Datasheet Sitemap LatestNews

User Search：

Room 1530, Zhongguancun MOOC Times Building, Block B, 18 Zhongguancun Street, Haidian District, Beijing 100190, China Tel:(010)82350740 Postcode：100190

京公网安备 11010802033920号

快速回复返回顶部 Return list