Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Microchip |
package instruction | SOIC-8 |
Reach Compliance Code | unknown |
Maximum clock frequency (fCLK) | 80 MHz |
JESD-30 code | S-PDSO-G8 |
JESD-609 code | e3 |
length | 5.275 mm |
memory density | 8388608 bit |
Memory IC Type | FLASH |
memory width | 1 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 8 |
word count | 8388608 words |
character code | 8000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 8MX1 |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Package shape | SQUARE |
Package form | SMALL OUTLINE |
Parallel/Serial | SERIAL |
Peak Reflow Temperature (Celsius) | 260 |
Programming voltage | 3 V |
Filter level | TS 16949 |
Maximum seat height | 2.16 mm |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Matte Tin (Sn) |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 40 |
width | 5.275 mm |