MOTOROLA
Freescale Semiconductor, Inc.
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MPX2202/D
200 kPa On-Chip Temperature
Compensated & Calibrated
Pressure Sensors
The MPX2202/MPXV2202G device series is a silicon piezoresistive pressure sensor
providing a highly accurate and linear voltage output — directly proportional to the
applied pressure. The sensor is a single monolithic silicon diaphragm with the strain
gauge and a thin–film resistor network integrated on–chip. The chip is laser trimmed for
precise span and offset calibration and temperature compensation. They are designed
for use in applications such as pump/motor controllers, robotics, level indicators, medical
diagnostics, pressure switching, barometers, altimeters, etc.
Features
UNIBODY PACKAGE
•
Temperature Compensated Over 0°C to +85°C
•
Easy–to–Use Chip Carrier Package Options
•
Available in Absolute, Differential and Gauge Con-
figurations
Application Examples
•
Pump/Motor Controllers
•
Robotics
MPX2202A/D
CASE 344
•
Level Indicators
•
Medical Diagnostics
•
Pressure Switching
•
Barometers
•
Altimeters
Figure 1 illustrates a block diagram of the internal
circuitry on the stand–alone pressure sensor chip.
V
S
3
THIN FILM
TEMPERATURE
COMPENSATION
AND
CALIBRATION
CIRCUITRY
1
GND
MPX2202
MPXV2202G
SERIES
Motorola Preferred Device
0 to 200 kPa (0 to 29 psi)
40 mV FULL SCALE SPAN
(TYPICAL)
Freescale Semiconductor, Inc...
SMALL OUTLINE PACKAGE
SURFACE MOUNT
MPXV2202GP
CASE 1369
2
4
SENSING
ELEMENT
V
out+
V
out-
MPX2202AP/GP
CASE 344B
MPXV2202DP
CASE 1351
PIN NUMBER
1
2
MPX2202DP
CASE 344C
3
4
Gnd
+V
out
V
S
–V
out
5
6
7
8
N/C
N/C
N/C
N/C
Figure 1. Temperature Compensated Pressure
Sensor Schematic
VOLTAGE OUTPUT versus
APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the sensor is
directly proportional to the differential pressure applied.
The absolute sensor has a built–in reference vacu-
um. The output voltage will decrease as vacuum,
relative to ambient, is drawn on the pressure (P1) side.
The output voltage of the differential or gauge sensor
increases with increasing pressure applied to the
pressure (P1) side relative to the vacuum (P2) side.
Similarly, output voltage increases as increasing vacu-
um is applied to the vacuum (P2) side relative to the
pressure (P1) side.
Preferred
devices are Motorola recommended choices for future use
and best overall value.
NOTE: Pin 1 is noted by the notch in
the lead.
MPX2202ASX/GSX
CASE 344F
PIN NUMBER
1
2
Gnd
+V
out
3
4
V
S
–V
out
MPX2202GVP
CASE 344D
Replaces MPX2200/D
REV 2
NOTE: Pin 1 is noted by the notch in
the lead.
Motorola Sensor Device Data
©
Motorola, Inc. 2002
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1
Freescale
MPX2202 MPXV2202G SERIES
MAXIMUM RATINGS
(NOTE)
Rating
Maximum Pressure (P1 > P2)
Storage Temperature
Operating Temperature
Semiconductor, Inc.
Symbol
P
max
T
stg
T
A
Value
800
–40 to +125
–40 to +125
Unit
kPa
°C
°C
NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device.
OPERATING CHARACTERISTICS
(V
S
= 10 Vdc, T
A
= 25°C unless otherwise noted, P1 > P2)
Characteristics
Pressure Range
(1)
Supply Voltage
Supply Current
Full Scale Span
(3)
Offset
(4)
Symbol
P
OP
V
S
I
o
V
FSS
V
off
∆V/∆P
MPX2202D Series
MPX2202A Series
—
—
—
TCV
FSS
TCV
off
Z
in
Z
out
t
R
—
—
Min
0
—
—
38.5
–1.0
—
–0.6
–1.0
—
—
–2.0
–1.0
1000
1400
—
—
—
Typ
—
10
6.0
40
—
0.2
—
—
±0.1
±0.5
—
—
—
—
1.0
20
±0.5
Max
200
16
—
41.5
1.0
—
0.4
1.0
—
—
2.0
1.0
2500
3000
—
—
—
Unit
kPa
Vdc
mAdc
mV
mV
mV/kPa
%V
FSS
%V
FSS
%V
FSS
%V
FSS
mV
Ω
Ω
ms
ms
%V
FSS
Freescale Semiconductor, Inc...
Sensitivity
Linearity
(5)
Pressure Hysteresis
(5)
(0 to 200 kPa)
Temperature Hysteresis
(5)
(–40°C to +125°C)
Temperature Effect on Full Scale Span
(5)
Temperature Effect on Offset
(5)
Input Impedance
Output Impedance
Response Time
(6)
(10% to 90%)
Warm–Up
Offset Stability
(7)
NOTES:
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self–heating.
3. Full Scale Span (V
FSS
) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (V
off
) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
•
Linearity:
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
•
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
•
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
•
TcSpan:
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
•
TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative
to 25°C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
2
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Motorola Sensor Device Data
Freescale Semiconductor,
MPX2202 MPXV2202G SERIES
Inc.
LINEARITY
Linearity refers to how well a transducer’s output follows
the equation: V
out
= V
off
+ sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 2) or (2)
a least squares best line fit. While a least squares fit gives
the “best case” linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola’s
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange
pressure.
LEAST SQUARES FIT
RELATIVE VOLTAGE OUTPUT
EXAGGERATED
PERFORMANCE
CURVE
LEAST
SQUARE
DEVIATION
STRAIGHT LINE
DEVIATION
END POINT
STRAIGHT LINE FIT
OFFSET
0
50
PRESSURE (% FULLSCALE)
100
Freescale Semiconductor, Inc...
Figure 2. Linearity Specification Comparison
ON–CHIP TEMPERATURE COMPENSATION and CALIBRATION
Figure 3 shows the output characteristics of the
MPX2202/MPXV2202G series at 25°C. The output is directly
proportional to the differential pressure and is essentially a
straight line.
The effects of temperature on Full Scale Span and Offset
are very small and are shown under Operating Characteristics.
40
35
OUTPUT (mVdc)
30
25
20
15
10
5
0
-5
kPa 0
PSI
V
S
= 10 Vdc
T
A
= 25°C
P1 > P2
MAX
TYP
SPAN
RANGE
(TYP)
MIN
25
50
7.25
75
100
14.5
PRESSURE
125
150
21.75
175
200
29
OFFSET
Figure 3. Output versus Pressure Differential
SILICONE GEL
DIE COAT
WIRE BOND
WIRE BOND
LEAD FRAME
DIFFERENTIAL/GAUGE ELEMENT
P2
DIE
BOND
LEAD FRAME
Figure 4. Cross–Sectional Diagrams (Not to Scale)
Figure 4 illustrates an absolute sensing die (right) and the
differential or gauge die in the basic chip carrier (Case 344).
A silicone gel isolates the die surface and wire bonds from
the environment, while allowing the pressure signal to be
transmitted to the silicon diaphragm.
The MPX2202/MPXV2202G series pressure sensor oper-
ating characteristics and internal reliability and qualification
tests are based on use of dry air as the pressure media. Me-
dia other than dry air may have adverse effects on sensor
performance and long term reliability. Contact the factory for
information regarding media compatibility in your application.
Motorola Sensor Device Data
For More Information On This Product,
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ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
ABSOLUTE ELEMENT
P2
DIFFERENTIAL/GAUGE
STAINLESS STEEL
DIE
METAL COVER
P1
EPOXY
CASE
SILICONE GEL ABSOLUTE
DIE COAT
DIE
P1
STAINLESS STEEL
METAL COVER
EPOXY
CASE
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
DIE
BOND
3
Freescale
MPX2202 MPXV2202G SERIES
Semiconductor, Inc.
tial pressure applied, P1 > P2. The absolute sensor is
designed for vacuum applied to P1 side.
The Pressure (P1) side may be identified by using the
table below:
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing the silicone gel
which isolates the die from the environment. The differential
or gauge sensor is designed to operate with positive differen-
Part Number
MPX2202A
MPX2202DP
MPX2202AP
MPX2202GVP
MPX2202ASX
MPXV2202GP
MPX2202GSX
MPX2202GP
MPX2202D
Case Type
344
344C
344B
344D
344F
1369
1351
Pressure (P1) Side Identifier
Stainless Steel Cap
Side with Part Marking
Side with Port Attached
Stainless Steel Cap
Side with Port Attached
Side with Port Attached
Side with Part Marking
Freescale Semiconductor, Inc...
MPXV2202DP
ORDERING INFORMATION — UNIBODY PACKAGE (MPX2202 SERIES)
MPX Series
Device Type
Basic Element
Ported Elements
Options
Absolute, Differential
Differential, Dual Port
Absolute, Gauge
Absolute, Gauge Axial
Gauge, Vacuum
Case Type
344
344C
344B
344F
344D
Order Number
MPX2202A
MPX2202D
MPX2202DP
MPX2202AP
MPX2202GP
MPX2202ASX
MPX2202GSX
MPX2202GVP
Device Marking
MPX2202A
MPX2202D
MPX2202DP
MPX2202AP
MPX2202GP
MPX2202A
MPX2202D
MPX2202GVP
ORDERING INFORMATION — SMALL OUTLINE PACKAGE (MPXV2202G SERIES)
Device Type
Ported Elements
Options
Gauge, Side Port, SMT
Differential, Dual Port, SMT
Case No.
1369
1351
MPX Series Order No.
MPXV2202GP
MPXV2202DP
Packing Options
Trays
Trays
Marking
MPXV2202G
MPXV2202G
4
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Motorola Sensor Device Data
Freescale Semiconductor,
MPX2202 MPXV2202G SERIES
Inc.
SMALL OUTLINE PACKAGE DIMENSIONS
2 PLACES 4 TIPS
0.008 (0.20) C A B
A
E
e
5
4
GAGE
PLANE
e/2
.014 (0.35)
θ
L
DETAIL G
A1
D
8
1
8X
F
b
0.004 (0.1)
M
C A B
Freescale Semiconductor, Inc...
B
E1
NOTES:
1. CONTROLLING DIMENSION: INCH.
2. INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M-1994.
3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)
PER SIDE.
4. DIMENSION "b" DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.008 (0.203) MAXIMUM.
DIM
A
A1
b
D
E
E1
e
F
K
L
M
N
P
T
θ
INCHES
MIN
MAX
0.300
0.330
0.002
0.010
0.038
0.042
0.465
0.485
0.717 BSC
0.465
0.485
0.100 BSC
0.245
0.255
0.120
0.130
0.061
0.071
0.270
0.290
0.080
0.090
0.009
0.011
0.115
0.125
0
°
7
°
MILLIMETERS
MIN
MAX
7.11
7.62
0.05
0.25
0.96
1.07
11.81
12.32
18.21 BSC
11.81
12.32
2.54 BSC
6.22
6.47
3.05
3.30
1.55
1.80
6.86
7.36
2.03
2.28
0.23
0.28
2.92
3.17
0
°
7
°
∅
T
N
K
A
8X
M
P
0.004 (0.1)
SEATING
PLANE
DETAIL G
C
CASE 1369–01
ISSUE O
Motorola Sensor Device Data
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