IGBT Modules Power Module - IGBT
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Microsemi |
Parts packaging code | MODULE |
package instruction | FLANGE MOUNT, R-XUFM-X25 |
Contacts | 25 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Shell connection | ISOLATED |
Maximum collector current (IC) | 42 A |
Collector-emitter maximum voltage | 600 V |
Configuration | COMPLEX |
Gate-emitter maximum voltage | 20 V |
JESD-30 code | R-XUFM-X25 |
JESD-609 code | e1 |
Humidity sensitivity level | 1 |
Number of components | 4 |
Number of terminals | 25 |
Maximum operating temperature | 150 °C |
Package body material | UNSPECIFIED |
Package shape | RECTANGULAR |
Package form | FLANGE MOUNT |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Polarity/channel type | N-CHANNEL |
Maximum power dissipation(Abs) | 140 W |
Certification status | Not Qualified |
surface mount | NO |
Terminal surface | TIN SILVER COPPER |
Terminal form | UNSPECIFIED |
Terminal location | UPPER |
Maximum time at peak reflow temperature | NOT SPECIFIED |
transistor applications | MOTOR CONTROL |
Transistor component materials | SILICON |
Nominal off time (toff) | 111 ns |
Nominal on time (ton) | 44 ns |