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XQAROY-02-0000-000000703

CategoryLED optoelectronic/LED   
File Size1MB,18 Pages
ManufacturerCree
Websitehttp://www.cree.com/
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XQAROY-02-0000-000000703 Parametric

Parameter NameAttribute value
Product CategoryHigh Power LEDs - Single Color
ManufacturerCree
RoHSDetails
PackagingCut Tape
PackagingMouseReel
PackagingReel
Factory Pack Quantity250
CLD-DS135 Rev 1C
Product family data sheet
Cree
®
XLamp
®
XQ-A LEDs
ProDuCt DEsCriPtion
The
XLamp
®
XQ-A
LeD
brings
a
mid-power, cost-effective option to the
proven, compact ceramic XQ package,
enabling lighting manufacturers to quickly
and easily expand their product portfolio
by leveraging a common XQ design.
Unlike
to
plastic
the
mid-power
long-term
LeDs,
the
ceramic-based XQ-A LeDs are designed
deliver
calculated
lifetimes of Cree’s other high-power
LeDs. The XQ-A LeD’s combination
of optical symmetry and consistency
across all colors improves color mixing
and simplifies the production process
for lighting manufacturers. Available in
both white and color configurations, the
XQ-A LeD family opens up new design
possibilities for a wide spectrum of
lighting applications, such as portable,
directional,
lighting.
architectural
and
vehicle
FEAturEs
Cree’s smallest lighting class LeD:
1.6 X 1.6 mm
Available in 70-, 80- & 90-CRI white,
and royal blue, blue, green, PC amber,
red-orange & red
Maximum drive current: white:
300 mA, color: 250 mA
Wide viewing angle: white: 100°,
royal blue, blue, PC amber: 105°,
green, red-orange, red: 110°
Reflow solderable - JEDEC
J-STD-020C compatible
Unlimited floor life at
≤ 30 °C/85% RH
RoHS compliant
UL
®
recognized component
(E349212)
tAbLE oF ContEnts
Characteristics ........................................2
Flux Characteristics - White....................3
Flux Characteristics - Color ....................4
Relative Spectral Power Distribution .....6
Relative Flux vs. Junction Temperature
.7
electrical Characteristics ........................8
Relative Flux vs. Current .........................9
Relative Chromaticity vs. Current and
Temperature ..........................................11
Typical Spatial Distribution...................12
Thermal Design .....................................13
Reflow Soldering Characteristics
.........14
Notes .....................................................15
Mechanical Dimensions .......................16
Tape and Reel ........................................17
Packaging ..............................................18
www.CRee.Com/XLAmp
Copyright © 2016-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
and XLamp
®
are
registered trademarks and the Cree logo is a trademark of Cree, Inc. UL
®
and the UR logo are registered trademarks of UL LLC.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
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