A family for all your analog
radio reception needs
NXP low-IF analog car radio tuner family TEF66xx
Alignment free easy application
analog car radio tuners
Recent generations of NXP’s one-chip low-IF tuners continue to expand the frontiers
of front-end excellence. At the same time, increasing component integration reduces
design complexity and cuts board space requirements.
Our TEF66xx ICs represents a real breakthrough
innovation for the analog car radio market.
They are the market’s first alignment-free, low-IF
tuners that can be designed directly onto the main
board without in-depth RF know-how. This enables
OEM and aftersales manufacturers to benefit
from the technology while still reaching the high
performance requirements for car radio applications.
With the increasing number of features in the
car radio head unit, space also becomes an ever
more critical issue. Helping you fit more into
less, TEF66xx tuner ICs make traditional analog
AM/FM tuner modules obsolete. In addition to
having the tuner included on the main board,
these ICs incorporate all critical RF components
and therefore eliminating the need for those
components. Fully pin compatible, the TEF66xx
product family offers a range of different feature
sets to suit your feature / pricing area.
Meet the family
NXP’s TEF66xx family has been developed with our
strategic partner, Catena Radio Design, together
with a number of key customers. This ensures the
family offers a choice of features and performance
to meet a variety of price points.
Key features
• AM / FM tuner with low IF conversion
• PLL synthesizer with integrated VCO
• ntegrated AM LNA with AGC and RF selectivity
I
• tereo decoder with output for interfacing with
S
external analog or digital audio processor
• dvanced weak signal processing (soft mute,
A
stereo blend, high cut control)
• M / FM noise blanker (TEF6601 – FM noise
A
blanker only)
• ignal quality detection (level, wide band AM,
S
ultra sonic noise)
• I
2
C bus control
• RDS demodulator and / or decoder (TEF661x only)
• Single 8.5 V supply
• SO32 package
• Qualified in accordance with AEC-Q100
• Very low external component count
• Integrated FM LNA with AGC
• llows for fast software development because of
A
integrated radio knowledge and easy interface
• Very good AM / FM strong signal behavior
TEF66xx Family Overview
TEF6601
System
Supply
Output
IF filter
RD(B)S
FM
Demodulator / Decoder
Japan / EU / US bands
OIRT
Stereo Decoder
Noise Blanker
Weak Signal Processing
AM
LW
MW
SW
Noise Blanker
Weak Signal Processing
General
Package
AEC-Q100
Sampling
Mass Production Start
O
: has this feature
TEF6606
8.5V
L/R, MPX
PACS
X/X
O
O
O
O
O
O
O
O
O
O
SO32
O
Final samples
Q1 2009
TEF6613
8.5V
MPX, RDS
PACS
O/O
O
O
X
X
X
X
X
X
X
X
SO32
O
Final samples
Q2 2009
TEF6614
8.5V
L/R, MPX, RDS
PACS
O/X
O
O
O
O
O
O
O
O
O
O
SO32
O
Final samples
Q2 2009
TEF6616
8.5V
L/R, MPX, RDS
PACS
O/O
O
O
O
O
O
O
O
O
O
O
SO32
O
Final samples
Q2 2009
8.5V
L/R, MPX
X
X/X
O
X
O
O
O
O
O
X
X
O
SO32
O
Final samples
Q1 2009
X
: does not have this feature
TEF66xx block and application diagram
TEF66xx provides significant space savings
IFT
CER
IFT
10.7 MHz
IC
240 MHz
VCO
100 MHz
XTAL
FM
RF
100 MHz
FM
RF
20.5 MHz
XTAL
CER
IC
4 MHz
Convential state-of-the art tuner module: 48 x 40 mm
TEF66xx PCB area
The benefits of NXP’s
proven low-IF architecture
Whereas existing solutions require double IF
conversion, our TEF66xx devices eliminate both
10.7 MHz and 450 kHz IF transformer coils and
ceramics, as well as the expensive external
components for LNA and AGC in the AM and FM
front-ends. Additionally the fully integrated VCO
saves the external LC tank components.
Due to the low IF architecture, there are no critical
high frequency PCB layouts and alignments needed
anymore. Therefore, even set makers with limited RF
know-how or resources can apply the TEF66xx to the
main PCB board, saving significant costs by making
a tuner module design obsolete. Manufacturing is
also made easier by enabling full SMD applications.
Single layer PCB design is supported as well.
Easy to design on the main PCB
• Small application PCB area
• o critical external RF components due
N
to highest integration
– only 34 (all passive SMD) components required
– complete channel selectivity / VCO integrated
• Limited resources and RF know-how needed
• Supports single layer PCB design
Easy to manufacture
• Full SMD application possible (no hand mounting)
• ess handling due to small number of external
L
components
• No mechanical / software alignments needed
• Higher production throughput
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