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PPC440SP-ANC533C

Description
powerpc 440sp embedded processor
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size629KB,85 Pages
ManufacturerApplied Micro Circuits (MACOM)
Environmental Compliance
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PPC440SP-ANC533C Overview

powerpc 440sp embedded processor

PPC440SP-ANC533C Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerApplied Micro Circuits (MACOM)
Parts packaging codeBGA
package instructionBGA, BGA783,28X28,40
Contacts783
Reach Compliance Codecompliant
ECCN code3A001.A.3
Address bus width32
bit size32
boundary scanYES
maximum clock frequency666.66 MHz
External data bus width64
FormatFIXED POINT
Integrated cacheYES
JESD-30 codeS-PBGA-B783
length29 mm
low power modeYES
Number of terminals783
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA783,28X28,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply1.5,1.8,2.5,3.3 V
Certification statusNot Qualified
Maximum seat height3.27 mm
speed533 MHz
Maximum slew rate3000 mA
Maximum supply voltage1.6 V
Minimum supply voltage1.4 V
Nominal supply voltage1.5 V
surface mountYES
technologyCMOS
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width29 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
Base Number Matches1
Part Number 440SP
Revision 1.23 - Sept 26, 2006
Data Sheet
PowerPC 440SP Embedded Processor
Features
• PowerPC
440 processor core operating at up to
667MHz with 32-KB I- and D-caches (with parity
checking)
• On-chip 256-KB SRAM configurable as L2 Cache
or Ethernet Packet/Code store memory
• Selectable Processor:Bus clock ratios (Refer to
the Clocking chapter in the
PPC440SP Embedded
Processor User’s Manual
for details)
• Supports up to 4 GB (2 Chip Selects) of 64-bit/32-
bit SDRAM with ECC
– DDR1 266-333-400
– DDR2 400-533-667
• Three DDR PCI-X interfaces (32-bit or 64-bit) up
to 133 MHz (DDR 266) with support for
conventional PCI
• XOR Accelerator with DMA controller
• Processor can boot from PCI memory
• Optional: High throughput RAID 6 hardware
acceleration, performs XOR and Galois Field P &
Q parity computations, supports up to 255 drives
• I2O Messaging Unit with two DMA controllers
• External Peripheral Bus (24-bit Address, 8-bit
Data) for up to three devices
• One Ethernet 10/100/1000 Mbps half- or full-
duplex interface. Operational modes supported
are MII and GMII.
• Programmable Interrupt Controller supports
interrupts from a variety of sources.
• Programmable General Purpose Timers (GPT)
• Three serial ports (16750 compatible UART)
• Two IIC interfaces
• General Purpose I/O (GPIO) interface available
• JTAG interface for board level testing
Description
Designed specifically to address high-end embedded
applications for storage, the PowerPC 440SP
Embedded Processor (PPC440SP) provides a high-
performance, low power solution that interfaces to a
wide range of peripherals by incorporating on-chip
power management features and lower power
dissipation.
This chip contains a high-performance RISC
processor core, a DDR2 SDRAM controller,
configurable 256KB SRAM to be used as L2 cache or
software-controlled on-chip memory, three DDR PCI-X
bus interfaces, an Ethernet interface, an I2O/DMA
controller, control for external ROM and peripherals,
optional RAID 6 acceleration, an XOR DMA unit, serial
ports, IIC interfaces, and general purpose I/O.
Technology: CMOS Cu-11, 0.13mm
Package: 29mm, 783-ball, 1mm pitch, Flip Chip-
Plastic Ball Grid Array (FC-PBGA)
Power (estimated): Less than 6W @533MHz
Supply voltages required: 3.3V, 2.5V, 1.8V, 1.5V
AMCC Proprietary
1

PPC440SP-ANC533C Related Products

PPC440SP-ANC533C PPC440SP-ANC667C PPC440SP PPC440SP-RFC667C PPC440SP-AFC533C PPC440SP-RNC667C PPC440SP-AFC667C PPC440SP-RNC533C PPC440SP-RFC533C
Description powerpc 440sp embedded processor powerpc 440sp embedded processor powerpc 440sp embedded processor powerpc 440sp embedded processor powerpc 440sp embedded processor powerpc 440sp embedded processor powerpc 440sp embedded processor powerpc 440sp embedded processor powerpc 440sp embedded processor
Is it Rohs certified? conform to conform to - incompatible incompatible conform to incompatible conform to incompatible
Maker Applied Micro Circuits (MACOM) Applied Micro Circuits (MACOM) - Applied Micro Circuits (MACOM) Applied Micro Circuits (MACOM) Applied Micro Circuits (MACOM) Applied Micro Circuits (MACOM) Applied Micro Circuits (MACOM) Applied Micro Circuits (MACOM)
Parts packaging code BGA BGA - BGA BGA BGA BGA BGA BGA
package instruction BGA, BGA783,28X28,40 BGA, BGA783,28X28,40 - BGA, BGA783,28X28,40 BGA, BGA783,28X28,40 BGA, BGA783,28X28,40 BGA, BGA783,28X28,40 BGA, BGA783,28X28,40 BGA, BGA783,28X28,40
Contacts 783 783 - 783 783 783 783 783 783
Reach Compliance Code compliant compliant - compliant compliant compliant unknown compliant compliant
ECCN code 3A001.A.3 3A001.A.3 - 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3
Address bus width 32 32 - 32 32 32 32 32 32
bit size 32 32 - 32 32 32 32 32 32
boundary scan YES YES - YES YES YES YES YES YES
maximum clock frequency 666.66 MHz 666.66 MHz - 666.66 MHz 666.66 MHz 666.66 MHz 666.66 MHz 666.66 MHz 666.66 MHz
External data bus width 64 64 - 64 64 64 64 64 64
Format FIXED POINT FIXED POINT - FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT
Integrated cache YES YES - YES YES YES YES YES YES
JESD-30 code S-PBGA-B783 S-PBGA-B783 - S-PBGA-B783 S-PBGA-B783 S-PBGA-B783 S-PBGA-B783 S-PBGA-B783 S-PBGA-B783
length 29 mm 29 mm - 29 mm 29 mm 29 mm 29 mm 29 mm 29 mm
low power mode YES YES - YES YES YES YES YES YES
Number of terminals 783 783 - 783 783 783 783 783 783
Package body material PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA - BGA BGA BGA BGA BGA BGA
Encapsulate equivalent code BGA783,28X28,40 BGA783,28X28,40 - BGA783,28X28,40 BGA783,28X28,40 BGA783,28X28,40 BGA783,28X28,40 BGA783,28X28,40 BGA783,28X28,40
Package shape SQUARE SQUARE - SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY - GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 1.5,1.8,2.5,3.3 V 1.5,1.8,2.5,3.3 V - 1.5,1.8,2.5,3.3 V 1.5,1.8,2.5,3.3 V 1.5,1.8,2.5,3.3 V 1.5,1.8,2.5,3.3 V 1.5,1.8,2.5,3.3 V 1.5,1.8,2.5,3.3 V
Certification status Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.27 mm 3.27 mm - 3.27 mm 3.27 mm 3.27 mm 3.27 mm 3.27 mm 3.27 mm
speed 533 MHz 667 MHz - 667 MHz 533 MHz 667 MHz 667 MHz 533 MHz 533 MHz
Maximum slew rate 3000 mA 3000 mA - 3000 mA 3000 mA 3000 mA 3000 mA 3000 mA 3000 mA
Maximum supply voltage 1.6 V 1.575 V - 1.575 V 1.6 V 1.575 V 1.575 V 1.6 V 1.6 V
Minimum supply voltage 1.4 V 1.425 V - 1.425 V 1.4 V 1.425 V 1.425 V 1.4 V 1.4 V
Nominal supply voltage 1.5 V 1.5 V - 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V
surface mount YES YES - YES YES YES YES YES YES
technology CMOS CMOS - CMOS CMOS CMOS CMOS CMOS CMOS
Terminal form BALL BALL - BALL BALL BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm - 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM - BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 29 mm 29 mm - 29 mm 29 mm 29 mm 29 mm 29 mm 29 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR, RISC MICROPROCESSOR, RISC - MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1 - 1 1 1 1 1 1

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