TPS851
TOSHIBA Photo-IC
Silicon Epitaxial Planar
TPS851
Mobile Phones, PHS
Notebook PCs, PDAs
Video cameras, Digital Still Cameras
Other Equipment Requiring Luminosity Adjustment
The TPS851 is an ultra-compact surface-mount photo-IC for
illuminance sensors which incorporates a photodiode and current amp
TOSHIBA
―
circuit in a single chip.
Weight: 0.0054 g (typ.)
The sensitivity is superior to that of a phototransistor, and exhibits
little variation.
It has spectral sensitivity closer to luminous efficiency and excellent output linearity.
With its ultra-compact surface-mount package, this photo-IC can be used as the power-saving control for
domestic appliances or for backlighting for displays in cellular phones, this device enables low power consumption
to be achieved.
•
•
•
Ultra-compact and light surface-mount package: 2.0 × 2.1 × 0.7 mm
Excellent output linearity of illuminance
Little fluctuation in light current and high level of sensitivity
: I
L
= 37
μA
to 74
μA
@E
V
= 100 lx using fluorescent light
: Light current variation width: ×1.67 (when light current classification is specified.)
: Little temperature fluctuation
•
•
•
Built-in luminous-efficiency correction function, reduced sensitivity variations due to various light sources
: I
L
(using incandescent light)/I
L
(using fluorescent light) = 1.2 (typ.)
Low supply voltage, making device suitable for battery-powered equipment: V
CC
= 2.7 V to 5.5 V
Lead(Pb)-Free
Absolute Maximum Ratings
(Ta
=
25°C)
Characteristics
Supply voltage
Output voltage
Light current
Permissible power dissipation
Operating temperature range
Storage temperature range
Soldering temperature range
(Note 1)
Symbol
V
CC
V
OUT
I
L
P
T
opr
T
stg
T
sol
Rating
−0.5
to 7
Unit
V
V
mA
mW
°C
°C
°C
<
V
CC
=
5
35
−30
to 85
−40
to 100
260
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings and the operating ranges.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: The reflow time and the recommended temperature profile are shown in the section entitled Handling
Precautions.
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TPS851
Electrical and Optical Characteristics
(Ta
=
25°C)
Characteristics
Supply voltage
Supply current
Light current (1)
Symbol
V
CC
I
CC
I
L
(1)
Test Condition
⎯
V
CC
=
3 V, E
V
=
1000 lx
R
L
=
1 kΩ
V
CC
=
3 V, E
V
=
100 lx
(Note 2), (Note 4)
V
CC
=
3 V, E
V
=
10 lx
(Note 3), (Note 4)
V
CC
=
3 V, E
V
=
100 lx
(Note 3), (Note 4)
⎯
(Note 2)
Min
2.7
⎯
⎯
Typ.
⎯
620
62
Max
5.5
⎯
⎯
Unit
ς
μA
μA
Light current (2)
I
L
(2)
3.7
⎯
7.4
μA
Light current (3)
I
L
(3)
37
⎯
74
μA
Light current ratio
IL (1)
IL (3)
I
LEAK
V
O
λ
p
⎯
⎯
1.2
⎯
1.7
0.17
⎯
⎯
μ
A
Dark current
Saturation output voltage
Peak sensitivity wavelength
Switching time
Rise time
Fall time
V
CC
=
3.3 V, E
V
=
0
V
CC
=
3 V, R
L
=
150 k
Ω
, E
V
=
100 lx
(Note 3)
⎯
2.2
⎯
⎯
2.35
600
0.07
0.4
V
nm
ms
t
r
t
f
V
CC
=
3 V, R
L
=
5 k
Ω
(Note 5)
1
2
⎯
Note 2: CIE standard A light source is used (color temperature
=
2856K, approximated incandescence light).
Note 3: Fluorescence light is used as light source. However, white LED is substituted in a mass-production process.
I
L
(3) classification I
L
A: 37
μA
to 62
μA
Note 4: Light current measurement circuit
V
CC
I
L
TPS851
A
OUT
Light
source
Note 5: Rise time/fall time time measurement method
I
F
Pulse drive
White LED
TPS851
V
CC
OUT
R
L
1.5 V
90%
V
OUT
GND
10%
t
r
t
f
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2007-10-01
TPS851
Package Dimensions
Unit: mm
Tolerance:
±
0.1
( ): Reference value
: Light-receiving area
Size of light-receiving area:
(□0.35 mm)
Center of
sensitive area
Pin connection
1. V
CC
2. GND
3. NC
4. NC
5. OUT
Weight: 0.0054 g (typ.)
Block Diagram
1. V
CC
Current
amp
5. OUT
2. GND
3. NC
4. NC
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2007-10-01
TPS851
Handling Precautions
At power-on in darkness, the internal circuit takes about 100
μs
to stabilize. During this period the output signal
is unstable and may change. Please take this into account.
Moisture-Proof Packing
(1)
(2)
To avoid moisture absorption by the resin, the product is packed in an aluminum envelope with silica
gel.
Since the optical characteristics of the device can be affected during soldering by vaporization
resulting from prior absorption of moisture and they should therefore be stored under the following
conditions:
Temperature: 5°C to 30°C, Relative humidity: 60% (max), Time: 168 h (max)
Baking is required if the devices have been store unopened for more than six months or if the
aluminum envelope has been opened for more than 168 h.
These devices are packed on tapes; hence, please avoid baking at high temperature.
Recommended baking conditions: 60°C for 12 h or longer
(3)
Mounting Precautions
(1)
(2)
(3)
Do not apply stress to the resin at high temperature.
The resin part is easily scratched, so avoid friction with hard materials.
When installing the assembly board in equipment, ensure that this product does not come into
contact with other components.
Mounting Methods
(1)
Reflow soldering
•
Package surface temperature: 260°C (max)
•
Please perform reflow soldering using the following reference temperature profile.
Perform reflow soldering no more than twice.
Temperature (°C)
→
260°C max
230°C
190°C
180°C
Preheating part
60 s to 120 s
30 s to 50 s Heating part
Time (s)
→
•
•
Please perform the first reflow soldering within 168 h after opening the package with reference to
the above temperature profile.
Second reflow soldering
In case of second reflow soldering, it should be performed within 168 h after first reflow under the
above conditions.
Storage conditions before second reflow soldering: 30°C, 60% RH or lower
•
•
Do not perform flow soldering.
Make any necessary soldering correction manually.
(do not do this more than once for any given pin.)
Temperature: no more than 350°C (25 W for soldering iron)
Time: within 5 s
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2007-10-01
TPS851
(2)
Recommended soldering pattern
0.65
0.65
Unit: mm
1.9
0.4
(3)
Cleaning conditions
When cleaning is required after soldering
Chemicals: AK225 alcohol
Temperature and time: 50°C
×
30 s or 30°C
×
3 minutes
Ultrasonic cleaning: 300 W or less
Packing Specification
(1)
Packing quantity
Reel (minimum packing quantity)
Carton
3,000 devices
5 reels (15,000 devices)
(2)
Packing format
An aluminum envelope containing silica gel and reels is deaerated and sealed.
Pack shock-absorbent materials around the aluminum envelopes in the cartons to cushion them.
•
Carton specification
Label
Carton dimensions
(W) 81 mm
×
(L) 280 mm
×
(H) 280 mm
0.8
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2007-10-01
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