-
American chip giant Qualcomm is planning a big move recently. The Nikkei website reported that Cristiano Amon, president of Qualcomm, a US communications semiconductor giant, held a press conferenc...[Details]
-
0 Introduction
In recent years, the third generation mobile communication technology (3G) has been successfully commercialized in some countries in the world. Under different environmental condition...[Details]
-
In the past, various future black technologies have appeared before our eyes in very high-end forms, and this is even more so in science fiction novels or movies. Display-related black technolo...[Details]
-
summary
The Open Compute Project (OCP) is a nonprofit organization focused on promoting communication among companies on data center product design and best practices.
Recently...[Details]
-
TMS320C32 is a floating-point digital signal processor ( DSP ) produced by TI in the United States. It is a new product of TMS320 series floating-point digital signal processors. Its CPU is s...[Details]
-
This file can perfectly drive the 1602 LCD screen. For detailed calling methods, please see: http://www.51hei.com/bbs/dpj-24670-1.html . There are two files 1602.c and 1602.h header files (behind...[Details]
-
Application scenarios:
At present, front grille lights have been applied to models of many new car-making forces in China. Due to the huge product matrix, traditional car companies give priori...[Details]
-
Samsung Electronics will purchase 20 EUV lithography machines from ASML for $3.38 billion, an average of $170 million per machine. They will be used for advanced process wafer foundry and new generat...[Details]
-
Face recognition algorithms have been developed to this day and can be roughly divided into two categories: feature-based face recognition algorithms and appearance-based face recognition algorit...[Details]
-
To accelerate the development of the global non-memory chip industry, technology giant Samsung Electronics is increasing its presence in the global foundry sector by expanding contract chip manufactu...[Details]
-
IT Home reported on March 17 that a ZTE 5G digital mobile phone model ZTE A2021 has passed the 3C certification. The applicant, manufacturer and manufacturer are all ZTE Corporation, and the fi...[Details]
-
1. Project Overview 1.1 Introduction With the development of industrial production, transportation, urban construction, the increase in population density, and the increase in household facilities (a...[Details]
-
According to official news from China Machinery Engineering Corporation, the FAB electrical engineering project of the 8-inch non-storage wafer construction project of Haichen Semiconductor (Wuxi) Co...[Details]
-
By Gregg Burke , Texas Instruments Are you aware of all the latest technologies that are being incorporated into today’s new cars? It’s exciting, and some of them are even available in entry-l...[Details]
-
Data acquisition systems and programmable logic controllers (PLCs) require versatile, high-performance analog front ends to interface with a variety of sensors to accurately and reliably measure sign...[Details]
Automotive Electronics
京公网安备 11010802033920号
EEWORLD