1.5KCD9.1CA datasheet, PDF - EEWORLD Datasheet

1.5KCD9.1CA: Descriptioncellular die package; CategoryDiscrete semiconductor diode; File Size123KB，2 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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1.5KCD9.1CA Overview

cellular die package

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Microsemi
Objectid	2066734147
Parts packaging code	DIE
package instruction	O-MEDB-N2
Contacts	2
Reach Compliance Code	unknown
ECCN code	EAR99
compound_id	5611601
Maximum breakdown voltage	9.55 V
Minimum breakdown voltage	8.65 V
Breakdown voltage nominal value	8.6 V
Maximum clamping voltage	13.4 V
Configuration	SINGLE
Diode component materials	SILICON
Diode type	TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 code	O-MEDB-N2
JESD-609 code	e0
Maximum non-repetitive peak reverse power dissipation	1500 W
Number of components	1
Number of terminals	2
Package body material	METAL
Package shape	ROUND
Package form	DISK BUTTON
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
polarity	BIDIRECTIONAL
Certification status	Not Qualified
Maximum repetitive peak reverse voltage	7.78 V
surface mount	YES
technology	AVALANCHE
Terminal surface	TIN LEAD
Terminal form	NO LEAD
Terminal location	END
Maximum time at peak reflow temperature	NOT SPECIFIED
Base Number Matches	1

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