CDIP-16, Tube
Parameter Name | Attribute value |
Brand Name | Integrated Device Technology |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Parts packaging code | CDIP |
package instruction | DIP, DIP16,.3 |
Contacts | 16 |
Manufacturer packaging code | CD16 |
Reach Compliance Code | not_compliant |
ECCN code | EAR99 |
series | FCT |
JESD-30 code | R-GDIP-T16 |
JESD-609 code | e0 |
length | 20.066 mm |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | OTHER DECODER/DRIVER |
MaximumI(ol) | 0.032 A |
Humidity sensitivity level | 1 |
Number of functions | 2 |
Number of terminals | 16 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Output polarity | INVERTED |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | 240 |
power supply | 5 V |
Prop。Delay @ Nom-Sup | 6.2 ns |
propagation delay (tpd) | 6.2 ns |
Certification status | Not Qualified |
Filter level | MIL-STD-883 |
Maximum seat height | 5.08 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 7.62 mm |
Base Number Matches | 1 |
5962-9220206MEA | IDT54FCT139ATDB | IDT54FCT139CTDB | 5962-9220202MEA | IDT54FCT139TDB | IDT54FCT139CTLB | IDT54FCT139TLB | IDT54FCT139CTEB | IDT54FCT139TEB | IDT54FCT139ATLB | |
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Description | CDIP-16, Tube | Decoder/Driver, FCT Series, Inverted Output, CMOS, CDIP16, CERAMIC, DIP-16 | Decoder/Driver, FCT Series, Inverted Output, CMOS, CDIP16, CERAMIC, DIP-16 | CDIP-16, Tube | Decoder/Driver, FCT Series, Inverted Output, CMOS, CDIP16, CERAMIC, DIP-16 | Decoder/Driver, FCT Series, Inverted Output, CMOS, CQCC20, LCC-20 | Decoder/Driver, FCT Series, Inverted Output, CMOS, CQCC20, LCC-20 | Decoder/Driver, FCT Series, Inverted Output, CMOS, CDFP16, CERAMIC, DFP-16 | Decoder/Driver, FCT Series, Inverted Output, CMOS, CDFP16, CERPACK-16 | Decoder/Driver, FCT Series, Inverted Output, CMOS, CQCC20, LCC-20 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Parts packaging code | CDIP | DIP | DIP | CDIP | DIP | QLCC | QLCC | DFP | DFP | QLCC |
package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | QCCN, LCC20,.35SQ | QCCN, LCC20,.35SQ | DFP, FL16,.3 | DFP, FL16,.3 | QCCN, LCC20,.35SQ |
Contacts | 16 | 16 | 16 | 16 | 16 | 20 | 20 | 16 | 16 | 20 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | _compli |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
series | FCT | FCT | FCT | FCT | FCT | FCT | FCT | FCT | FCT | FCT |
JESD-30 code | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 | S-CQCC-N20 | S-CQCC-N20 | R-GDFP-F16 | R-GDFP-F16 | S-CQCC-N20 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
Logic integrated circuit type | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER |
MaximumI(ol) | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A |
Number of functions | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
Number of terminals | 16 | 16 | 16 | 16 | 16 | 20 | 20 | 16 | 16 | 20 |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
Output polarity | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DIP | DIP | DIP | DIP | DIP | QCCN | QCCN | DFP | DFP | QCCN |
Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | LCC20,.35SQ | LCC20,.35SQ | FL16,.3 | FL16,.3 | LCC20,.35SQ |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | FLATPACK | FLATPACK | CHIP CARRIER |
Peak Reflow Temperature (Celsius) | 240 | 225 | NOT SPECIFIED | 240 | 225 | NOT SPECIFIED | 225 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
propagation delay (tpd) | 6.2 ns | 7.8 ns | 6.2 ns | 12 ns | 12 ns | 6.2 ns | 12 ns | 6.2 ns | 12 ns | 7.8 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Filter level | MIL-STD-883 | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO | NO | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | FLAT | FLAT | NO LEAD |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD | QUAD | DUAL | DUAL | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED | 20 | NOT SPECIFIED | NOT SPECIFIED | 20 | NOT SPECIFIED | 30 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
length | 20.066 mm | 20.066 mm | 20.066 mm | 20.066 mm | 20.066 mm | 8.89 mm | 8.89 mm | - | - | 8.89 mm |
Prop。Delay @ Nom-Sup | 6.2 ns | 7.8 ns | 6.2 ns | 12 ns | 12 ns | 6.2 ns | 12 ns | 6.2 ns | 12 ns | - |
Maximum seat height | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 2.54 mm | 2.54 mm | - | - | 2.54 mm |
width | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 8.89 mm | 8.89 mm | - | - | 8.89 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - | - |
Input adjustment | - | STANDARD | STANDARD | - | STANDARD | STANDARD | STANDARD | - | - | STANDARD |
Maker | - | - | - | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |