SRAM Module, 128KX32, 35ns, CMOS, CQFP68, CERAMIC, QFP-68
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Micross |
| Parts packaging code | QFP |
| package instruction | QFP, QFP68,.99SQ,50 |
| Contacts | 68 |
| Reach Compliance Code | compliant |
| ECCN code | 3A001.A.2.C |
| Maximum access time | 35 ns |
| Other features | ALSO CONFIGURABLE AS 512K X 8 |
| Spare memory width | 16 |
| I/O type | COMMON |
| JESD-30 code | S-CQFP-G68 |
| JESD-609 code | e0 |
| length | 22.352 mm |
| memory density | 4194304 bit |
| Memory IC Type | SRAM MODULE |
| memory width | 32 |
| Number of functions | 1 |
| Number of terminals | 68 |
| word count | 131072 words |
| character code | 128000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 128KX32 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QFP |
| Encapsulate equivalent code | QFP68,.99SQ,50 |
| Package shape | SQUARE |
| Package form | FLATPACK |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 Class C |
| Maximum seat height | 5.08 mm |
| Maximum standby current | 0.006 A |
| Minimum standby current | 2 V |
| Maximum slew rate | 0.52 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | TIN LEAD |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 22.352 mm |
| Base Number Matches | 1 |
| AS8S128K32Q-35/883C | AS8S128K32Q-25/883C | AS8S128K32Q-45/883C | AS8S128K32Q-20/883C | |
|---|---|---|---|---|
| Description | SRAM Module, 128KX32, 35ns, CMOS, CQFP68, CERAMIC, QFP-68 | SRAM Module, 128KX32, 25ns, CMOS, CQFP68, CERAMIC, QFP-68 | SRAM Module, 128KX32, 45ns, CMOS, CQFP68, CERAMIC, QFP-68 | SRAM Module, 128KX32, 20ns, CMOS, CQFP68, CERAMIC, QFP-68 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | QFP | QFP | QFP | QFP |
| package instruction | QFP, QFP68,.99SQ,50 | QFP, QFP68,.99SQ,50 | QFP, QFP68,.99SQ,50 | QFP, QFP68,.99SQ,50 |
| Contacts | 68 | 68 | 68 | 68 |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| ECCN code | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| Maximum access time | 35 ns | 25 ns | 45 ns | 20 ns |
| Other features | ALSO CONFIGURABLE AS 512K X 8 | ALSO CONFIGURABLE AS 512K X 8 | ALSO CONFIGURABLE AS 512K X 8 | ALSO CONFIGURABLE AS 512K X 8 |
| Spare memory width | 16 | 16 | 16 | 16 |
| I/O type | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | S-CQFP-G68 | S-CQFP-G68 | S-CQFP-G68 | S-CQFP-G68 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| length | 22.352 mm | 22.352 mm | 22.352 mm | 22.352 mm |
| memory density | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
| Memory IC Type | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
| memory width | 32 | 32 | 32 | 32 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 68 | 68 | 68 | 68 |
| word count | 131072 words | 131072 words | 131072 words | 131072 words |
| character code | 128000 | 128000 | 128000 | 128000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C |
| organize | 128KX32 | 128KX32 | 128KX32 | 128KX32 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QFP | QFP | QFP | QFP |
| Encapsulate equivalent code | QFP68,.99SQ,50 | QFP68,.99SQ,50 | QFP68,.99SQ,50 | QFP68,.99SQ,50 |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Filter level | MIL-STD-883 Class C | MIL-STD-883 Class C | MIL-STD-883 Class C | MIL-STD-883 Class C |
| Maximum seat height | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
| Maximum standby current | 0.006 A | 0.006 A | 0.006 A | 0.006 A |
| Minimum standby current | 2 V | 2 V | 2 V | 2 V |
| Maximum slew rate | 0.52 mA | 0.56 mA | 0.5 mA | 0.6 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 22.352 mm | 22.352 mm | 22.352 mm | 22.352 mm |
| Maker | Micross | - | Micross | Micross |
| Base Number Matches | 1 | 1 | 1 | - |
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