Standard SRAM, 512KX8, 20ns, CMOS, CDFP32, CERAMIC, FP-32
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Micross |
Parts packaging code | DFP |
package instruction | DFP, LCC32,.45X.55 |
Contacts | 32 |
Reach Compliance Code | unknown |
ECCN code | 3A001.A.2.C |
Maximum access time | 20 ns |
Other features | LOW POWER STANDBY |
I/O type | COMMON |
JESD-30 code | R-CDFP-F32 |
JESD-609 code | e0 |
length | 20.955 mm |
memory density | 4194304 bit |
Memory IC Type | STANDARD SRAM |
memory width | 8 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 32 |
word count | 524288 words |
character code | 512000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 512KX8 |
Output characteristics | 3-STATE |
Exportable | YES |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DFP |
Encapsulate equivalent code | LCC32,.45X.55 |
Package shape | RECTANGULAR |
Package form | FLATPACK |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Filter level | MIL-STD-883 Class C |
Maximum seat height | 2.8956 mm |
Maximum standby current | 0.0045 A |
Minimum standby current | 2 V |
Maximum slew rate | 0.225 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | FLAT |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 11.43 mm |
Base Number Matches | 1 |