N25Q256A13ESFH0G datasheet, PDF

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N25Q256A13ESFH0G: DescriptionFlash, 256MX1, PDSO16, 0.300 INCH, ROHS COMPLIANT, SOP2-16; Categorystorage storage; File Size1MB，91 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/; Environmental Compliance

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N25Q256A13ESFH0G Overview

Flash, 256MX1, PDSO16, 0.300 INCH, ROHS COMPLIANT, SOP2-16

N25Q256A13ESFH0G Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Micron Technology
Parts packaging code	SOIC
package instruction	SOP,
Contacts	16
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum clock frequency (fCLK)	108 MHz
JESD-30 code	R-PDSO-G16
JESD-609 code	e3
length	10.3 mm
memory density	268435456 bit
Memory IC Type	FLASH
memory width	1
Number of functions	1
Number of terminals	16
word count	268435456 words
character code	256000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256MX1
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	260
Programming voltage	3 V
Maximum seat height	2.65 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	MATTE TIN
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
type	NOR TYPE
width	7.5 mm

N25Q256A13ESFH0G Related Products

	N25Q256A13ESFH0G	N25Q256A13ESFH0E
Description	Flash, 256MX1, PDSO16, 0.300 INCH, ROHS COMPLIANT, SOP2-16	Flash, 256MX1, PDSO16, 0.300 INCH, ROHS COMPLIANT, SOP2-16
Is it lead-free?	Lead free	Lead free
Is it Rohs certified?	conform to	conform to
Maker	Micron Technology	Micron Technology
Parts packaging code	SOIC	SOIC
package instruction	SOP,	0.300 INCH, ROHS COMPLIANT, SOP2-16
Contacts	16	16
Reach Compliance Code	compliant	compliant
ECCN code	EAR99	3A991.B.1.B.1
Maximum clock frequency (fCLK)	108 MHz	108 MHz
JESD-30 code	R-PDSO-G16	R-PDSO-G16
JESD-609 code	e3	e3
length	10.3 mm	10.3 mm
memory density	268435456 bit	268435456 bit
Memory IC Type	FLASH	FLASH
memory width	1	1
Number of functions	1	1
Number of terminals	16	16
word count	268435456 words	268435456 words
character code	256000000	256000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
organize	256MX1	256MX1
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	SOP
Package shape	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE
Parallel/Serial	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	260	260
Programming voltage	3 V	3 V
Maximum seat height	2.65 mm	2.65 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal surface	MATTE TIN	MATTE TIN
Terminal form	GULL WING	GULL WING
Terminal pitch	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL
Maximum time at peak reflow temperature	30	30
type	NOR TYPE	NOR TYPE
width	7.5 mm	7.5 mm

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