PIC24EP512GU810-E/BG datasheet, PDF

Datasheet> All Categories > The embedded processor and controller> Microcontrollers and processors> PIC24EP512GU810-E/BG

PIC24EP512GU810-E/BG: Description16-bit microcontrollers - mcu 100p 512kb 52kb ram 60 mhz usb; CategoryThe embedded processor and controller Microcontrollers and processors; ManufacturerMicrochip; Websitehttps://www.microchip.com; Environmental Compliance

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PIC24EP512GU810-E/BG Overview

16-bit microcontrollers - mcu 100p 512kb 52kb ram 60 mhz usb

PIC24EP512GU810-E/BG Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Microchip
Parts packaging code	BGA
package instruction	TPBGA-121
Contacts	121
Reach Compliance Code	compliant
ECCN code	3A001.A.3
Factory Lead Time	11 weeks
Has ADC	YES
Address bus width
bit size	16
boundary scan	YES
CPU series	PIC24
maximum clock frequency	60 MHz
DAC channel	NO
DMA channel	YES
External data bus width
Format	FLOATING-POINT
Integrated cache	NO
JESD-30 code	S-PBGA-B121
JESD-609 code	e1
length	10 mm
low power mode	YES
Number of DMA channels	15
Number of external interrupt devices	5
Number of I/O lines	83
Number of serial I/Os
Number of terminals	121
Number of timers	9
On-chip data RAM width	8
On-chip program ROM width	8
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA121,11X11,32
Package shape	SQUARE
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
RAM (bytes)	53248
rom(word)	548864
ROM programmability	FLASH
Maximum seat height	1.2 mm
speed	60 MHz
Maximum slew rate	320 mA
Maximum supply voltage	3.6 V
Minimum supply voltage	3 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

User Manual

AN3399 - Safeguarding Flash Memory Self-Write Operations

PIC24EP512GU810-E/BG Related Products

	PIC24EP512GU810-E/BG	PIC24EP256GU810T-I/BG	PIC24EP256GU810-I/BG	PIC24EP512GP806-I/PT	PIC24EP512GU814-E/PH	DSPIC33EP256MU806T-I/PTVAO	DSPIC33EP256MU814-E/PLVAO
Description	16-bit microcontrollers - mcu 100p 512kb 52kb ram 60 mhz usb	16-bit microcontrollers - mcu 100p 256kb 28kb ram 60 mhz usb	16-bit microcontrollers - mcu 100p 256kb 28kb ram 60 mhz usb			Microcontroller, 16-Bit, FLASH, 60MHz, CMOS, PQFP64	Microcontroller, 16-Bit, FLASH, 60MHz, CMOS, PQFP144
package instruction	TPBGA-121	TPBGA-121	TPBGA-121	TQFP-64	TQFP-144	TFQFP, TQFP64,.47SQ	LQFP-144
Reach Compliance Code	compliant	compli	compliant	compliant	compliant	compliant	compliant
Has ADC	YES	YES	YES	YES	YES	YES	YES
bit size	16	16	16	16	16	16	16
boundary scan	YES	YES	YES	YES	YES	YES	YES
CPU series	PIC24	PIC24	PIC24	PIC24	PIC24	DSPIC33	DSPIC33
maximum clock frequency	60 MHz	60 MHz	60 MHz	60 MHz	60 MHz	60 MHz	60 MHz
DAC channel	NO	NO	NO	NO	NO	NO	NO
DMA channel	YES	YES	YES	YES	YES	YES	YES
Format	FLOATING-POINT	FLOATING-POINT	FLOATING-POINT	FLOATING-POINT	FLOATING-POINT	FLOATING-POINT	FLOATING-POINT
Integrated cache	NO	NO	NO	NO	NO	NO	NO
JESD-30 code	S-PBGA-B121	S-PBGA-B121	S-PBGA-B121	S-PQFP-G64	S-PQFP-G144	S-PQFP-G64	S-PQFP-G144
length	10 mm	10 mm	10 mm	10 mm	16 mm	10 mm	20 mm
low power mode	YES	YES	YES	YES	YES	YES	YES
Number of DMA channels	15	15	15	15	15	15	15
Number of external interrupt devices	5	5	5	5	5	5	5
Number of I/O lines	83	83	83	53	122	51	122
Number of terminals	121	121	121	64	144	64	144
Number of timers	9	9	9	9	9	9	9
On-chip data RAM width	8	8	8	8	8	8	8
On-chip program ROM width	8	8	8	8	8	8	8
Maximum operating temperature	125 °C	85 °C	85 °C	85 °C	125 °C	85 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
PWM channel	YES	YES	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	TFBGA	TFBGA	TFQFP	TFQFP	TFQFP	LFQFP
Encapsulate equivalent code	BGA121,11X11,32	BGA121,11X11,32	BGA121,11X11,32	TQFP64,.47SQ	TQFP144,.7SQ,16	TQFP64,.47SQ	QFP144,.87SQ,20
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	FLATPACK, THIN PROFILE, FINE PITCH	FLATPACK, THIN PROFILE, FINE PITCH	FLATPACK, THIN PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH
RAM (bytes)	53248	28672	28672	53248	53248	28672	28672
rom(word)	548864	286720	286720	548864	548864	286720	286720
ROM programmability	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.6 mm
speed	60 MHz	70 MHz	70 MHz	70 MHz	60 MHz	70 MHz	60 MHz
Maximum slew rate	320 mA	320 mA	320 mA	320 mA	320 mA	320 mA	320 mA
Maximum supply voltage	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	AUTOMOTIVE	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	AUTOMOTIVE	INDUSTRIAL	AUTOMOTIVE
Terminal form	BALL	BALL	BALL	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.5 mm	0.4 mm	0.5 mm	0.5 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	QUAD	QUAD	QUAD	QUAD
width	10 mm	10 mm	10 mm	10 mm	16 mm	10 mm	20 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	-	-
Maker	Microchip	Microchip	Microchip	Microchip	-	Microchip	Microchip
Parts packaging code	BGA	BGA	BGA	-	QFP	-	-
Contacts	121	121	121	-	144	-	-
ECCN code	3A001.A.3	3A991.A.2	3A001.A.3	3A991.A.2	3A991.A.2	-	-
Factory Lead Time	11 weeks	11 weeks	11 weeks	11 weeks	7 weeks	-	-
JESD-609 code	e1	e1	e1	e3	e3	-	-
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	260	260	-	-
power supply	3.3 V	3.3 V	3.3 V	-	3.3 V	-	-
Certification status	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	-	-
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	-	-
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	40	40	-	-

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