CD54HC158F datasheet, PDF - EEWORLD Datasheet

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CD54HC158F: DescriptionCD54HC158F; Categorylogic logic; File Size374KB，5 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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CD54HC158F

CD54HC158F Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Renesas Electronics Corporation
Reach Compliance Code	not_compliant
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
Load capacitance (CL)	50 pF
Logic integrated circuit type	MULTIPLEXER
MaximumI(ol)	0.004 A
Number of functions	4
Number of entries	2
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	2/6 V
Prop。Delay @ Nom-Sup	42 ns
Certification status	Not Qualified
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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CD54HC158F Related Products

	CD54HC158F	5962-01-273-6758	CD54HC157H	CD54HCT157H	CD74HC157SM
Description	CD54HC158F	IC,LOGIC MUX,QUAD,2-INPUT,HCT-CMOS,DIP,16PIN,CERAMIC	CD54HC157H	CD54HCT157H	CD74HC157SM
Maker	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation
Reach Compliance Code	not_compliant	not_compliant	unknown	unknown	_compli
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER
MaximumI(ol)	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A
Number of functions	4	4	4	4	4
Number of entries	2	2	2	2	2
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	85 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-40 °C
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIE OR CHIP	DIE OR CHIP	SSOP16,.3
power supply	2/6 V	5 V	2/6 V	5 V	2/6 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	INDUSTRIAL
Is it Rohs certified?	incompatible	incompatible	-	-	incompatible
JESD-30 code	R-XDIP-T16	R-XDIP-T16	-	-	R-PDSO-G16
Number of terminals	16	16	-	-	16
Package body material	CERAMIC	CERAMIC	-	-	PLASTIC/EPOXY
encapsulated code	DIP	DIP	-	-	SSOP
Package shape	RECTANGULAR	RECTANGULAR	-	-	RECTANGULAR
Package form	IN-LINE	IN-LINE	-	-	SMALL OUTLINE, SHRINK PITCH
Prop。Delay @ Nom-Sup	42 ns	45 ns	38 ns	45 ns	-
surface mount	NO	NO	-	-	YES
Terminal form	THROUGH-HOLE	THROUGH-HOLE	-	-	GULL WING
Terminal pitch	2.54 mm	2.54 mm	-	-	0.635 mm
Terminal location	DUAL	DUAL	-	-	DUAL

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