IC fpga 448 I/O 668fcbga
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | XILINX |
| Parts packaging code | BGA |
| package instruction | FBGA-668 |
| Contacts | 668 |
| Reach Compliance Code | not_compliant |
| ECCN code | 3A991.D |
| Factory Lead Time | 12 weeks |
| maximum clock frequency | 1205 MHz |
| JESD-30 code | S-PBGA-B668 |
| JESD-609 code | e0 |
| length | 27 mm |
| Humidity sensitivity level | 4 |
| Configurable number of logic blocks | 6656 |
| Number of entries | 448 |
| Number of logical units | 59904 |
| Output times | 448 |
| Number of terminals | 668 |
| organize | 6656 CLBS |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | BGA |
| Encapsulate equivalent code | BGA668,26X26,40 |
| Package shape | SQUARE |
| Package form | GRID ARRAY |
| Peak Reflow Temperature (Celsius) | 225 |
| Programmable logic type | FIELD PROGRAMMABLE GATE ARRAY |
| Certification status | Not Qualified |
| Maximum seat height | 2.85 mm |
| Maximum supply voltage | 1.26 V |
| Minimum supply voltage | 1.14 V |
| Nominal supply voltage | 1.2 V |
| surface mount | YES |
| technology | CMOS |
| Terminal surface | Tin/Lead (Sn63Pb37) |
| Terminal form | BALL |
| Terminal pitch | 1 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | 30 |
| width | 27 mm |
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