32-BIT, 667MHz, MICROPROCESSOR, PBGA783, 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-783
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Objectid | 2055895268 |
Parts packaging code | BGA |
package instruction | 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-783 |
Contacts | 783 |
Reach Compliance Code | not_compliant |
ECCN code | 5A991 |
YTEOL | 0 |
Address bus width | 64 |
bit size | 32 |
boundary scan | YES |
maximum clock frequency | 166 MHz |
External data bus width | 64 |
Format | FIXED POINT |
Integrated cache | YES |
JESD-30 code | S-PBGA-B783 |
JESD-609 code | e2 |
length | 29 mm |
low power mode | YES |
Humidity sensitivity level | 3 |
Number of terminals | 783 |
Maximum operating temperature | 105 °C |
Minimum operating temperature | |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Encapsulate equivalent code | BGA783,28X28,40 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | 260 |
Certification status | Not Qualified |
Maximum seat height | 3.85 mm |
speed | 667 MHz |
Maximum supply voltage | 1.26 V |
Minimum supply voltage | 1.14 V |
Nominal supply voltage | 1.2 V |
surface mount | YES |
technology | CMOS |
Temperature level | OTHER |
Terminal surface | Tin/Silver (Sn/Ag) |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 40 |
width | 29 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR |