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CL31A226KQCLNNC

Description
Ceramic Capacitor, Multilayer, Ceramic, 6.3V, 10% +Tol, 10% -Tol, X5R, 15% TC, 22uF, Surface Mount, 1206, CHIP
CategoryPassive components    capacitor   
File Size78KB,2 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Environmental Compliance  
Download Datasheet Parametric View All

CL31A226KQCLNNC Overview

Ceramic Capacitor, Multilayer, Ceramic, 6.3V, 10% +Tol, 10% -Tol, X5R, 15% TC, 22uF, Surface Mount, 1206, CHIP

CL31A226KQCLNNC Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Objectid1311626677
package instruction, 1206
Reach Compliance Codecompliant
Country Of OriginMainland China, Philippines, South Korea
ECCN codeEAR99
YTEOL6.9
capacitance22 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
JESD-609 codee3
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance10%
Number of terminals2
Maximum operating temperature85 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTR, CARDBOARD, 7 INCH
positive tolerance10%
Rated (DC) voltage (URdc)6.3 V
size code1206
surface mountYES
Temperature characteristic codeX5R
Temperature Coefficient15% ppm/°C
Terminal surfaceTin (Sn) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
SPECIFICATION
Supplier : Samsung electro-mechanics
Product : Multi-layer Ceramic Capacitor
A. Samsung Part Number
CL
Series
Size
Dielectric
Capacitance
Capacitance
tolerance
Rated Voltage
Thickness
31
A
226
K
Q
C
L
N
N
C
Samsung P/N :
CL31A226KQCLNNC
Descriptiont :
CAP, 22㎌, 6.3V, ±10%, X5R, 1206
Samsung Multi-layer Ceramic Capacitor
1206 (inch code)
X5R
22
±10 %
6.3 V
0.85 ± 0.1
mm
L: 3.2 ± 0.2
mm
W:
1.6
± 0.2
mm
Thickness division
Inner electrode
Termination
Plating
Product
Special
Packaging
Low profile
Ni
Cu
Sn 100%
Normal
Reserved for future use
Cardboard Type, 7" reel
(Pb Free)
B. Samsung Reliablility Test and Judgement condition
Performance
Capacitance
Tan
δ
(DF)
Insulation
Resistance
Appearance
Withstanding
Voltage
Temperature
Characterisitcs
Adhesive Strength
of Termination
Bending Strength
Solderability
Within specified tolerance
0.1 max.
10,000Mohm or 100Mohm⋅㎌
Whichever is Smaller
No abnormal exterior appearance
No dielectric breakdown or
mechanical breakdown
X5R
(From -55℃ to 85℃, Capacitance change shoud be within ±15%)
No peeling shall be occur on the
500g⋅F, for 10±1 sec.
terminal electrode
Capacitance change :
within ±12.5% Bending to the limit (1mm)
with 1.0mm/sec.
More than 75% of terminal surface
is to be soldered newly
SnAg3.0Cu0.5 solder
245±5℃, 3±0.3sec.
(preheating : 80~120℃ for 10~30sec.)
Resistance to
Soldering heat
Capacitance change :
Tan
δ,
IR : initial spec.
within ±7.5%
Solder pot : 270±5℃, 10±1sec.
Rated Voltage
60~120 sec.
120㎐±20%
Test condition
0.5±0.1Vrms
Microscope (×10)
250% of the rated voltage

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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