IC,PROM,4KX4,TTL,DIP,20PIN,CERAMIC
| Parameter Name | Attribute value |
| Objectid | 1167341179 |
| package instruction | DIP, DIP20,.3 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| YTEOL | 0 |
| Maximum access time | 55 ns |
| JESD-30 code | R-XDIP-T20 |
| JESD-609 code | e0 |
| memory density | 16384 bit |
| Memory IC Type | OTP ROM |
| memory width | 4 |
| Number of terminals | 20 |
| word count | 4096 words |
| character code | 4000 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 4KX4 |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP20,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| Maximum slew rate | 0.17 mA |
| surface mount | NO |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
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