power zeners
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Microsemi |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Other features | METALLURGICALLY BONDED |
Shell connection | CATHODE |
Configuration | SINGLE |
Diode component materials | SILICON |
Diode type | ZENER DIODE |
Maximum dynamic impedance | 1 Ω |
JESD-30 code | O-MUPM-X1 |
JESD-609 code | e0 |
Number of components | 1 |
Number of terminals | 1 |
Package body material | METAL |
Package shape | ROUND |
Package form | POST/STUD MOUNT |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
polarity | UNIDIRECTIONAL |
Maximum power dissipation | 10 W |
Certification status | Not Qualified |
Nominal reference voltage | 10 V |
Maximum reverse current | 100 µA |
Reverse test voltage | 7.6 V |
surface mount | NO |
technology | ZENER |
Terminal surface | TIN LEAD |
Terminal form | UNSPECIFIED |
Terminal location | UPPER |
Maximum time at peak reflow temperature | NOT SPECIFIED |
Maximum voltage tolerance | 5% |
Working test current | 250 mA |