Customer
1/ 7
Endrich Bauelemente Vertriebs GmbH
S PE CI FI CATI O N S
Code No. 721SD04680b
Thick film chip thermistor
Type: TFT6G(2.00mm×1.25mm) (Sn Plating)
TFT3G(1.60mm×0.80mm) (Sn Plating)
TFT16G(1.00mm×0.50mm)
(Sn Plating)
If you find herein anything not in order, please let us know
immediately. Otherwise, these terms and conditions shall be
expressly accepted by you.
Date: Jun. 14, 2005
APPR.
CHK
DWG
K. Murakami
T. Horita
T. Matsumoto
TATEYAMA KAGAKU IND. CO., LTD.
3-6 TSUKIOKA-MACHI, TOYAMA CITY TOYAMA 939-8132 JAPAN
Tel: 076-429-3588 Fax: 076-429-6630
Specifications
Thick film chip thermistor
1
Scope
VERSION
1
CODE No.
721SD04680b
2/7
This specification apply to thick film chip thermistor, product code is TFT6G/3G/16G.
2
Part Number
(Example)
TFT 6G
1
2 3
Item
1. Product name
2. Size
J 154 H 410 V
4
5
6
7
8
TFT: Thick film chip thermistor (Sn Plating)
6G: 2.00mm×1.25mm
3G: 1.60mm×0.80mm
16G: 1.00mm×0.50mm
Nil: B
25/85
(½
1
= 25℃,
½
2
= 85℃)
D: B
25/50
(½
1
= 25℃,
½
2
= 50℃)
E: B
25/100
(½
1
= 25℃,
½
2
= 100℃)
K: ±10%
J: ±5%
H: ±3%
G: ±2%
F: ±1%
3 figures : Applied to all nominal resistance.
(E-24)
(2 significant figures, number of zeros)
J: ±5%
H: ±3%
G: ±2%
F: ±1%
3 figures : Applied except B-value 3435K.
(3 significant figures)
4 figures : Only applied to B-value 3435K.
(4 significant figures)
V: 180φ taping
Code
TFT
(ex) 6G
3. Function
(ex) Nil
4. Resistance tolerance
(ex) J
5. Nominal resistance
6. B-value tolerance
(ex)
472 (=4.7kΩ)
154 (=150kΩ)
(ex) H
7. Nominal B-value
(ex)
345 (=3450K)
410 (=4100K)
(ex) V
8. Taping
3
3.1
Ratings
Ratings
Item
Resistance
B-value
Spec
Within
value
Within
value
Conditions
specified
specified
Measured temperature: 25
±
0.1°C
Measured power: 0.1mW or less
Calculate B-value by expression in below.
Ｂ-value[Ｋ]＝(lnＲ
1
−lnＲ
2
)／(１/Ｔ
1
−１/Ｔ
2
)
Dissipation
factor
Thermal time
constant
Rated power
Within 1.5mW/°C
Within 5sec
5mW
Ｒ
1
,Ｒ
2
：
resistance at
½
1
℃,½
2
℃[Ω]
Ｔ
1
,Ｔ
2
absolute temperature of½
1
℃,½
2
℃
= (½
1
+273.15)[Ｋ], (½
2
+273.15) [Ｋ]
：
It means power to heat up 1°C of thermistor itself.
Soldered with copper lead (φ0.1mm) and measured in the static air of 25℃.
It means time to change 63.2% of temperature from initial to stability.
Soldered with copper lead (φ0.1mm) and measured in the static air.
For thermistors operated in ambient
100
temperature over 120°C, rated
power
shall
be
derated
in
accordance with the curve right.
Ratio to dissipation(%)
0
120
125
Ambient temperature（℃）
Category
temperature
-40°C~+125°C
(Note)
Dissipation constant and thermal time constant are changed by soldering condition, environment.
TATEYAMA KAGAKU IND. CO., LTD.
Specifications
Thick film chip thermistor
3.2 Resistance range and B-value
B-value
4610~4800K
4410~4600K
4210~4400K
4010~4200K
3810~4000K
3610~3800K
3410~3600K
3210~3400K
3010~3200K
2810~3000K
2610~2800K
Standard resistance range
6G(Ω)
47k~2M
10k~2M
6.8k~2M
1k~220k
1k~150k
1k~150k
1k~150k
680~150k
220~150k
100~100k
100~1k
VERSION
1
CODE No.
721SD04680b
3/7
Standard resistance range
3G(Ω)
68k~2M
10k~2M
10k~2M
1k~220k
1k~150k
1k~150k
1k~150k
1k~150k
470~150k
150~100k
100~1k
Standard resistance range
16G(Ω)
100k∼2M
10k~2M
10k~2M
10k~220k
2k~150k
2k~150k
2k~150k
2k~150k
680~68k
500~47k
100~10k
4
Performances and test methods
Item
Resistance to
soldering heat
Solderability
Performances
Change of resistance;
within ±3.0%
No mechanical damage.
At least 95% of
termination covered
with new solder
Change of resistance;
within ±3.0%
No mechanical damage.
Test methods
Temperature of solder: 260±5°C
Immersion time: 10±1 seconds.
Temperature of solder: 245±5°C
Immersion time: 3±0.5 seconds.
Preparation: Immersion in flux for 1~2 seconds.
Flux: rosin: methanol = 25wt%:75wt%
Solder: Sn-3.0Ag-0.5Cu
Applied bending: 5mm
Substrate: glass fiber base epoxy resin
Holding time: 10±1seconds
t=1.6mm
unit：mm
20
50
Substrate
bending
R230
Strength
45
45
Vibration
Stability
Low
temperature
Humidity
Temperature
cycle
Change of resistance;
within ±3.0%
No mechanical damage.
Change of resistance;
within ±3.0%
Change of B-value;
within ±2.0%
Change of resistance;
within ±3.0%
Change of B-value;
within ±2.0%
Change of resistance;
within ±3.0%
Change of B-value;
within ±2.0%
Change of resistance;
within ±3.0%
Change of B-value;
within ±2.0%
Change of resistance;
within ±3.0%
Change of B-value;
within ±2.0%
Applied frequency: 10~55~10Hz / 1minute
Amplitude: 1.5mm in each X,Y,Z directions
Applied time: 2 hours in each X,Y,Z directions
Temperature: 125±3°C
Holding time: 1000±
４８
hours
０
Temperature: -40±3°C
Holding time: 1000±
４８
hours
０
Temperature: 85±2°C
Humidity: 85±5%RH
Holding time: 1000±
４８
hours
０
Repeat the temperature cycle as below 100 times.
Step１：-40±3°C
30minutes
Step２：room
temperature within 3minutes
Step３：125±3°C
30minutes
Step４：room
temperature within 3minutes
Temperature: 85±2°C
Humidity: 85±5% RH
Applied power: rated power
Holding time: 90minutes on, 30minutes off for 1000±
４８
hours
０
Load
humidity
TATEYAMA KAGAKU IND. CO., LTD.
Specifications
Thick film chip thermistor
5
Appearance and Dimensions
VERSION
1
CODE No.
721SD04680b
4/7
5.1 Appearance and construction
Appearance: No mechanical damage and no abnormalities.
Protective coating: Black.
Construction:
T h e r m isto r
P ro te ctiv e co a tin g
T e rm in a tio n
（
In n e r + S e c o n d + T h ird
）
S u b s tra te
Materials:
Construction
Substrate
Thermistor
Protective coating
Inner termination
Second termination
Third termination
Main Material
Al
2
O
3
(96%)
Thick film (Mn-Co)
Thick film (Glass)
Thick film (Ag-Pd)
Plating(Ni)
Plating(Sn)
5.2 Dimensions
L
Unit : mm
t
W
b
b
6G
3G
16G
L
2.00±0.20
1.60±0.15
1.00±0.05
W
1.25±0.20
0.80±0.15
0.50±0.05
t
0.55±0.10
0.50±0.10
0.35±0.05
b
0.40±0.20
0.30±0.20
＋０．０５
0.25
−０．１０
6
Taping
Type of taping
Taping of rectangular
punched carrier system
Carrier tape
Paper
Top cover tape
Thermal adhesion
plastics
Bottom cover tape
Thermal adhesion
paper
6.1 Materials
TATEYAMA KAGAKU IND. CO., LTD.
Specifications
Thick film chip thermistor
6.2 Dimensions
6G, 3G
φD0
VERSION
1
CODE No.
721SD04680b
5/7
16G
φD0
½
1
P
0
P
2
Sprocket hole
½
1
E
P
0
Sprocket hole
E
W
B
F
W
B
F
½
2
Chip
A
P
1
Rectangularly-hole
component
compartment
Direction of
unreeling
½
2
Chip
A
P
1
Rectangularly-hole
component
compartment
Direction of
unreeling
Type
6G
3G
16G
Ａ
1.65±0.20
1.10±0.20
0.65±0.10
Ｂ
2.40±0.20
1.90±0.20
1.15±0.10
Ｗ
8.00±0.20
Ｆ
3.50±0.05
Ｅ
1.75±0.10
Unit:mm
Type
6G, 3G
16G
Ｐ1
4.00±0.10
2.00±0.05
Ｐ2
2.00±0.05
Ｐ0
4.00±0.10
4.00±0.10
Ｄ0
1.55±0.05
½1
1.00max.
0.50max.
½2
1.40max.
1.00max.
remark：Pitch tolerance over any 10 pitches of
Ｐ0
is
±0.2mm.
6.3 Performances of taping
1. Strength of carrier tape and cover tape: 10N(1.02kgf) or more
2. Peel force of top cover tape: 5~70gf
(Peeling angle = 165~180°, peeling speed = about 200mm/min.)
１６５∼１８０゜
pu ll
Di re ct i on of
Top cover tape
Carrier tape
Bottom cover tape
Direction of unreeling
TATEYAMA KAGAKU IND. CO., LTD.
PCB Design
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