1200 bps Single Chip FSK MODEM
Parameter Name | Attribute value |
Maker | OKI |
Parts packaging code | DIP |
package instruction | DIP, |
Contacts | 28 |
Reach Compliance Code | unknow |
Other features | HALF DUPLEX |
data rate | 1.2 Mbps |
JESD-30 code | R-PDIP-T28 |
length | 36.7 mm |
Number of functions | 1 |
Number of terminals | 28 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Certification status | Not Qualified |
Maximum seat height | 5.08 mm |
Maximum slew rate | 18 mA |
Nominal supply voltage | 12 V |
surface mount | NO |
Telecom integrated circuit types | MODEM |
Temperature level | COMMERCIAL |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
width | 15.24 mm |
MSM6927RS | MSM6927GS-2K | MSM6927GS-K | MSM6947GS-K | MSM6947RS | MSM6947 | MSM6927 | |
---|---|---|---|---|---|---|---|
Description | 1200 bps Single Chip FSK MODEM | 1200 bps Single Chip FSK MODEM | 1200 bps Single Chip FSK MODEM | 1200 bps Single Chip FSK MODEM | 1200 bps Single Chip FSK MODEM | 1200 bps Single Chip FSK MODEM | 1200 bps Single Chip FSK MODEM |
Maker | OKI | OKI | OKI | OKI | OKI | - | - |
Parts packaging code | DIP | QFP | QFP | QFP | DIP | - | - |
package instruction | DIP, | QFP, | QFP, | QFP, | DIP, | - | - |
Contacts | 28 | 44 | 44 | 44 | 28 | - | - |
Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | - | - |
Other features | HALF DUPLEX | - | HALF DUPLEX | HALF DUPLEX | HALF DUPLEX | - | - |
data rate | 1.2 Mbps | 1.2 Mbps | 1.2 Mbps | 1.2 Mbps | 1.2 Mbps | - | - |
JESD-30 code | R-PDIP-T28 | R-PQFP-G44 | R-PQFP-G44 | R-PQFP-G44 | R-PDIP-T28 | - | - |
length | 36.7 mm | 10.5 mm | 10.5 mm | 10.5 mm | 36.7 mm | - | - |
Number of functions | 1 | 1 | 1 | 1 | 1 | - | - |
Number of terminals | 28 | 44 | 44 | 44 | 28 | - | - |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | - | - |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - |
encapsulated code | DIP | QFP | QFP | QFP | DIP | - | - |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - |
Package form | IN-LINE | FLATPACK | FLATPACK | FLATPACK | IN-LINE | - | - |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - |
Maximum seat height | 5.08 mm | 2.25 mm | 2 mm | 2 mm | 5.08 mm | - | - |
Maximum slew rate | 18 mA | 18 mA | 18 mA | 18 mA | 18 mA | - | - |
Nominal supply voltage | 12 V | 12 V | 12 V | 12 V | 12 V | - | - |
surface mount | NO | YES | YES | YES | NO | - | - |
Telecom integrated circuit types | MODEM | MODEM | MODEM | MODEM | MODEM | - | - |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | - |
Terminal form | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | - | - |
Terminal pitch | 2.54 mm | 0.8 mm | 0.8 mm | 0.8 mm | 2.54 mm | - | - |
Terminal location | DUAL | QUAD | QUAD | QUAD | DUAL | - | - |
width | 15.24 mm | 9.5 mm | 9.5 mm | 9.5 mm | 15.24 mm | - | - |